Abstract: Cu/Co multilayer film and single-layer copper film on silicon substrate were prepared by jet electrodeposition.The morphology of the multilayer film,the adhesion between multilayer and substrate,the adhesion between single-layer copper film and substrate,and the effects of scratch directions on the adhesion were studied.The results show that polishing the substrate can decrease the adhesion between the film and the substrate,and roughening can improve the adhesion to some extent.The adhesion between multilayer film and substrate is higher than that between single-film and substrate.When the scratch direction is parallel to the direction of the workpiece movement direction,the internal stress is nonuniform,easily to cause the stress accumulation and then make the critical load decreasing,resulting in the adhesion less than the one with scratch direction perpendicular to the workpiece movement direction obviously.