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C5210磷青铜薄板微弯曲回弹的尺寸效应

刘慧慧, 王欣, 欧阳金栋, 易龙, 郝传海, 张博

刘慧慧, 王欣, 欧阳金栋, 易龙, 郝传海, 张博. C5210磷青铜薄板微弯曲回弹的尺寸效应[J]. 机械工程材料, 2017, 41(7): 29-33. DOI: 10.11973/jxgccl201707006
引用本文: 刘慧慧, 王欣, 欧阳金栋, 易龙, 郝传海, 张博. C5210磷青铜薄板微弯曲回弹的尺寸效应[J]. 机械工程材料, 2017, 41(7): 29-33. DOI: 10.11973/jxgccl201707006
LIU Huihui, WANG Xin, OUYANG Jindong, YI Long, HAO Chuanhai, ZHANG Bo. Size Effect of Micro-bending Spring-Back for C5210 Phosphor Bronze Sheet[J]. Materials and Mechanical Engineering, 2017, 41(7): 29-33. DOI: 10.11973/jxgccl201707006
Citation: LIU Huihui, WANG Xin, OUYANG Jindong, YI Long, HAO Chuanhai, ZHANG Bo. Size Effect of Micro-bending Spring-Back for C5210 Phosphor Bronze Sheet[J]. Materials and Mechanical Engineering, 2017, 41(7): 29-33. DOI: 10.11973/jxgccl201707006

C5210磷青铜薄板微弯曲回弹的尺寸效应

详细信息
    作者简介:

    刘慧慧(1982-),女,安徽阜阳人,高级工程师,硕士

  • 中图分类号: TG146.2

Size Effect of Micro-bending Spring-Back for C5210 Phosphor Bronze Sheet

  • 摘要: 采用RG-2000型微机控制电子万能试验机,通过微弯曲试验,研究了C5210磷青铜薄板的厚度、晶粒尺寸以及弯曲半径等相关尺寸对其微弯曲回弹的影响。结果表明:C5210磷青铜薄板的厚度、晶粒尺寸和弯曲半径等对其回弹均有显著的影响,具有明显的尺寸效应;薄板的厚度越大,回弹量越小,厚度对回弹量的影响非常显著;薄板的晶粒尺寸越大,回弹量越小,当晶粒尺寸大于40 μm时,回弹量呈缓慢减小趋势;回弹量随着弯曲半径的增大而增大,而且薄板的厚度越小,增大的趋势越明显。
    Abstract: Micro-bending tests were conducted by RG-2000 micro-computer control electronic universal testing machine. The influence of thickness, grain size, bending radius of C5210 phosphor bronze sheet on micro-bending spring-back was researched. Results show that the thickness, grain size, bending radius of C5210 phosphor bronze sheet had a significant effect on the spring-back and that showed an obvious size effect. The spring-back amount decreased as sheet thickness increased, and thickness affected the spring-back amount obviously. The spring-back amount decreased with increasing of grain size, when the grain size was larger than 40 μm, the amount of spring-back decreased slowly. The spring-back amount increased as the bending radius increased, and the trend of increase was more obvious when the thickness of sheet was smaller.
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出版历程
  • 收稿日期:  2016-02-28
  • 修回日期:  2017-04-11
  • 刊出日期:  2017-07-19

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