Microstructure and Properties of Electroplated Chromium Layer with Different Thicknesses
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摘要: 为了改善电镀厚铬层气密性差的现状，采用工厂现行的电镀工艺在基体表面制备不同厚度的铬层，研究了不同厚度铬层的表面内应力、硬度、晶粒大小和织构。结果表明：随着厚度的增加，铬层表面内应力呈波动性变化，且表面内应力均为拉应力；随着厚度的增加，铬层中的大尺寸晶粒增多，但平均晶粒尺寸变化不大，均为8.5 μm左右；随着铬层厚度的增加，（110）晶面织构逐渐退化，（200）晶面织构逐渐增强；随着铬层厚度的增加，铬层硬度先缓慢增大，当铬层厚度由22.51 μm增加到46.02 μm时则迅速增大，随后又缓慢增大。Abstract: In order to improve air tightness of the electroplated thick chromium layer, chromium layers with different thicknesses were prepared on the surface of substrate by the actual electroplating process in the factory. The surface internal stress, hardness, grain size and texture of the chromium layers with different thicknesses were studied. The results show that with the increase of the thickness, the surface internal stress of the chromium layer fluctuated. The surface internal stress was tensile stress. With the increase of the thickness, the larger grains in the chromium layer increased, but the average grain size changed little and was about 8.5 μm. With the increase of the thickness, (110) crystal surface texture gradually degraded, (200) crystal surface texture was enhanced gradually. With the increase of the thickness, the hardness of the chromium layer increased slowly and then rapidly when the thickness increased from 22.51 μm to 46.02 μm, and then increased slowly.
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Keywords:
- electroplated chromium layer /
- surface internal stress /
- micro-hardness /
- grain size /
- texture
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[1] MATSUMOTODR M, IJOMAHDR W. Remanufacturing[M]. Netherlands:Springer, 2013:389-408.
[2] 徐滨士,梁秀兵,史佩京,等. 我国再制造工程及其产业发展[J]. 表面工程与再制造,2015,15(2):6-10. [3] GEORGE D. A history of chromium plating[J]. Plating and Surface Finishing, 1984, 71(6):84-90.
[4] 王秋红,潘湛昌,胡光辉,等. 三价铬电镀铬镀层性能的研究[J]. 材料研究与应用,2010, 4(4):467-469. [5] 奚兵. 镀铬层的性能及影响因素[J]. 腐蚀与防护, 2000, 21(11):502-504. [6] 吴首民, 陈声鹤, 周庚瑞,等. 镀层厚度对镀铬钢板性能的影响[J]. 机械工程材料, 2011, 35(3):25-27. [7] 周绍民.金属电沉积——原理与研究方法[M]. 上海:上海科学技术出版社,1987:254-269. [8] 安茂忠. 电镀理论与技术[M]. 哈尔滨:哈尔滨工业大学出版社,2004. [9] CHOI J H, KANG S Y, DONG N L. Relationship between deposition and recrystallization textures of copper and chromium electrodeposits[J]. Journal of Materials Science, 2000, 35(16):4055-4066.
[10] YLI-PENTTI A. Electroplating and electroless plating[J]. Comprehensive Materials Processing, 2014, 198(4):277-306.
[11] 陈亚,李士嘉,王春林,等. 现代实用电镀技术[M]. 北京:国防工业出版社,2003:185-203. [12] SNAVELY C A. A theory for the mechanism of chromium plating; a theory for the physical characteristics of chromium plate[J]. Transactions of the Electrochemical Society, 1947, 92(6):537-577.
[13] WRIGHT L, HIRST H, RILEY J. The structure of electrolytic chromium[J]. Transaction of the Faraday Society, 1935, 31:1253-1259.
[14] 吕镖,胡振峰,汪笑鹤,等. 电流密度对镍镀层结构和性能的影响[J]. 中国表面工程,2013,26(4):66-71. [15] 蔡芬敏,彭文屹,易光斌,等. 电解铜箔织构的研究[J].热加工工艺,2011,40(24):9-11. [16] NIELSEN C B, LEISNER P, HORSEWELL A. On texture formation of chromium electrodeposits[J]. Journal of Applied Electrochemistry, 1998, 28(2):141-150.
[17] 崔忠圻,覃耀春. 金属学与热处理[M]. 北京:机械工业出版社,2007:143-156. [18] CYMBOLISTE M. The structure and hardness of electrolytic chromium[J]. Transactions of the Electrochemical Society, 1938,73(1):353-363.
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