Abstract: With tourmaline as heat dissipation raditor and copper as binding phase, copper-tourmaline composite heat dissipation materials containing 15wt%-30wt% copper were prepared by powder metallurgy. The microstructure, relative density, heat dissipation performance, bending strength and fracture morphology of the composites were studied. The results show that with increasing copper content, the structure of the composite became homogenous and dense, the relative density increased and the heat dissipation performance was improved. The composites with different copper content had better heat dissipation performance than T2 copper had, and the natural cooling rate was 1.95-2.78 times higher than that of T2 copper. With increasing copper content, the bending strength of the composite increased. When the copper content was no less than 20wt%, the bending strength was all above 30 MPa, meeting the strength requirement of electronic packaging materials. When the copper content increased up to 25wt%, a certain number of dimples were observed on fracutre surface of the composite, illustrating a ductile fracture feature.