High-temperature Ductility-dip Cracking Susceptibility of 52M Alloy Surfacing Layer Prepared by Different Processes
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摘要: 以52M合金焊丝为堆焊材料，分别采用激光堆焊和TIG堆焊在S304不锈钢基体上制备了52M合金堆焊层，研究了堆焊层的显微组织、物相组成和高温低塑性裂纹敏感性。结果表明：两种堆焊层的显微组织均为单相奥氏体；与TIG堆焊层相比，激光堆焊层的晶粒较小且形态规则；两种堆焊层中均有Cr23C6析出，激光堆焊层的析出物数量较少；在相同温度、不同应变下激光堆焊层中的裂纹数量均少于TIG堆焊层中的；随着应变的增加，激光堆焊层中的裂纹数量增加较快，但其高温低塑性裂纹敏感性较低。Abstract: 52M alloy surfacing layer was deposited on the substrate of S304 stainless steel by laser surfacing and TIG surfacing, respectively, with 52M alloy wire as surfacing material, and then the microstructure, phase composition and sensitivity of high-temperature ductility-dip cracking of the surfacing layers were studied. The results show that the microstructures of the two surfacing layers consisted of uniphase austenite. Compared with those of the TIG surfacing layer, the grain size of the laser surfacing layer was smaller and the grain shape was more regular. Cr23C6 was precipitated in the two surfacing layers. The amount of the precipitates in the laser surfacing layer was relatively small. The amount of cracks in the laser surfacing layer was smaller than that in the TIG surfacing layer at the same temperature and different strains. With the increase of strain, the amount of cracks in the laser surfacing layer increased faster, but the sensitivity of ductility-dip cracking was lower.
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