Abstract: Four low-melting-point (below 230 ℃) alloys, including Sn-3.5Ag, Sn-1.6Cu, Sn-Zn-0.7Cu, Sn-8Zn-3Bi, were smelted. On the basis of spreading areas of the four alloys on T2 copper substrate, the alloy having relatively good spreading effects was determined, and then the interface bonding property of the alloy with the copper substrate was analyzed. The results show that the Sn-1.6Cu alloy had the best spreading performance on T2 copper substrate, with the largest spreading area and a smooth spreading surface. The spreading performance of the Sn-3.5Ag took second place, and that of the Sn-Zn-0.7Cu alloy and Sn-8Zn-3Bi alloy was relatively poor. After the Sn-1.6Cu alloy was spread on the copper substrate, no defects such as pores and cracks at the interface were observed, and inter-diffusion of elements occurred at the interface, forming a copper-tin solid solution layer; the interface bonding property was good.