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    徐恺恺, 张亮, 孙磊, 熊明月, 赵猛, 姜楠. Sn-Zn钎料的研究进展[J]. 机械工程材料, 2020, 44(6): 1-5,32. DOI: 10.11973/jxgccl202006001
    引用本文: 徐恺恺, 张亮, 孙磊, 熊明月, 赵猛, 姜楠. Sn-Zn钎料的研究进展[J]. 机械工程材料, 2020, 44(6): 1-5,32. DOI: 10.11973/jxgccl202006001
    XU Kaikai, ZHANG Liang, SUN Lei, XIONG Mingyue, ZHAO Meng, JIANG Nan. Research Progress on Sn-Zn Solder[J]. Materials and Mechanical Engineering, 2020, 44(6): 1-5,32. DOI: 10.11973/jxgccl202006001
    Citation: XU Kaikai, ZHANG Liang, SUN Lei, XIONG Mingyue, ZHAO Meng, JIANG Nan. Research Progress on Sn-Zn Solder[J]. Materials and Mechanical Engineering, 2020, 44(6): 1-5,32. DOI: 10.11973/jxgccl202006001

    Sn-Zn钎料的研究进展

    Research Progress on Sn-Zn Solder

    • 摘要: 新型Sn-Zn无铅钎料无毒、价格低廉、与Sn-Pb钎料熔点相近,是最有可能替代传统Sn-Pb钎料的材料之一。结合国内外Sn-Zn系无铅钎料的研究成果,综述了添加合金元素对该钎料润湿性、抗氧化性、力学性能、显微组织以及界面组织的影响,并对其今后的研究方向提出了建议。

       

      Abstract: A new Sn-Zn lead-free solder is non-toxic, inexpensive, and has a similar melting point to Sn-Pb solder, which makes it one of the most likely material to replace traditional Sn-Pb solder. On the basis of research results of Sn-Zn system lead-free solder at home and abroad, the effects of the addition of alloying elements on the wettability, oxidation resistance, mechanical properties, microstructure and interface structure of the solder are summarized, and future research direction is put forward.

       

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