高级检索

    H62黄铜导体短路熔痕的凝固组织

    Solidification Structure of Short Circuit Melted Mark of H62 Brass Conductor

    • 摘要: 采用火灾模拟试验制备了H62黄铜导体一次短路熔痕和二次短路熔痕,研究了不同熔痕的凝固组织。结果表明:一次短路熔痕具有明显的过渡区特征,熔珠状一次短路熔痕室温凝固组织为α相,呈枝晶形貌,锌元素质量分数低于32.5%,而凹痕状一次短路熔痕室温凝固组织为α相+β相,α相沿β相晶界呈针状向β相晶内析出,且α相的针状晶未贯穿β相晶界,锌元素质量分数高于32.5%。二次短路熔痕呈熔珠状,具有明显的过渡区特征,室温凝固组织为α相+β相,α相呈羽毛状,且其排列具有方向性,锌元素质量分数高于32.5%。

       

      Abstract: The primary short circuit melted mark and secondary short circuit melted mark of H62 brass conductor were prepared by fire simulation tests, and the solidification structure of different melted marks was studied. The results show that the primary short circuit melted mark had obvious characteristics of transition zone. The solidification structure at room temperature of bead-shaped primary short circuit melted mark was α phase with dendritic morphology, and the mass fraction of Zn element was lower than 32.5%. The solidification structure at room temperature of dimpled primary short circuit melted mark was α+β phases; the α phase was precipitated into β phase grains in acicular shape along the grain boundaries of β phase, and the acicular crystal of α phase did not penetrate the grain boundaries of the β phase; the mass fraction of Zn element was higher than 32.5%. The secondary short circuit melted mark had a bead shape with obvious characteristics of transition zone; the solidified structure at room temperature was α+β phases, and the α phase was feather-like and arranged with direction; the mass fraction of Zn element was higher than 32.5%.

       

    /

    返回文章
    返回