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    刘继雄, 王文君, 黄拓, 王新, 王小翔, 王鼎春, 高颀. 扩散连接工艺对SP-700钛合金热轧板连接界面结合性能的影响[J]. 机械工程材料, 2020, 44(8): 23-26. DOI: 10.11973/jxgccl202008005
    引用本文: 刘继雄, 王文君, 黄拓, 王新, 王小翔, 王鼎春, 高颀. 扩散连接工艺对SP-700钛合金热轧板连接界面结合性能的影响[J]. 机械工程材料, 2020, 44(8): 23-26. DOI: 10.11973/jxgccl202008005
    LIU Jixiong, WANG Wenjun, HUANG Tuo, WANG Xin, WANG Xiaoxiang, WANG Dingchun, GAO Qi. Effect of Diffusion Bonding Process on Connection Interface Bonding Propertyof SP-700 Titanium Alloy Hot Rolled Sheet[J]. Materials and Mechanical Engineering, 2020, 44(8): 23-26. DOI: 10.11973/jxgccl202008005
    Citation: LIU Jixiong, WANG Wenjun, HUANG Tuo, WANG Xin, WANG Xiaoxiang, WANG Dingchun, GAO Qi. Effect of Diffusion Bonding Process on Connection Interface Bonding Propertyof SP-700 Titanium Alloy Hot Rolled Sheet[J]. Materials and Mechanical Engineering, 2020, 44(8): 23-26. DOI: 10.11973/jxgccl202008005

    扩散连接工艺对SP-700钛合金热轧板连接界面结合性能的影响

    Effect of Diffusion Bonding Process on Connection Interface Bonding Propertyof SP-700 Titanium Alloy Hot Rolled Sheet

    • 摘要: 对SP-700钛合金热轧板进行扩散连接试验,研究了扩散连接温度(720,750,780,810,840 ℃)和时间(5,15,30,45 min)对合金板连接界面形貌及结合强度的影响。结果表明:随扩散连接温度的升高和时间的延长,合金未结合区域减少直至消失,界面结合强度增加;温度越高,界面完全结合所需时间越短,在温度高于750 ℃下扩散连接30 min时,界面基本实现完全结合;在840 ℃扩散连接30 min后,合金结合界面上存在大量等轴α相,界面结合强度最高,达400 MPa。

       

      Abstract: Diffusion bonding test was performed on SP-700 titanium alloy hot rolled sheet, and the effects of diffusion bonding temperature (720, 750, 780, 810, 840 ℃) and time (5, 15, 30, 45 min) on the connection interface morphology and bonding strength were studied. The results show that with the increase of diffusion bonding temperature and time, the unbonded area of the alloy decreased until disappeared, and the interface bonding strength increased. The higher the temperature, the shorter the time interval required for fully integrating of the interface. When the bonding temperature was higher than 750 ℃ and time was 30 min, the interface was basically fully integrated. After diffusion bonding at 840 ℃ for 30 min, many equiaxed α phases existed on the bonding interface, and the interface bonding strength was the highest, reaching 400 MPa.

       

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