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    贺江涛, 蔡海潮, 薛玉君, 杨芳, 马喜强. 磁控溅射不同元素掺杂WS2薄膜的组织和纳米压痕力学性能[J]. 机械工程材料, 2020, 44(12): 24-28,36. DOI: 10.11973/jxgccl202012004
    引用本文: 贺江涛, 蔡海潮, 薛玉君, 杨芳, 马喜强. 磁控溅射不同元素掺杂WS2薄膜的组织和纳米压痕力学性能[J]. 机械工程材料, 2020, 44(12): 24-28,36. DOI: 10.11973/jxgccl202012004
    HE Jiangtao, CAI Haichao, XUE Yujun, YANG Fang, MA Xiqiang. Microstructure and Nanoindentation Mechanical Properties of WS2 Film withDifferent Doping Elements by Magnetron Sputtering[J]. Materials and Mechanical Engineering, 2020, 44(12): 24-28,36. DOI: 10.11973/jxgccl202012004
    Citation: HE Jiangtao, CAI Haichao, XUE Yujun, YANG Fang, MA Xiqiang. Microstructure and Nanoindentation Mechanical Properties of WS2 Film withDifferent Doping Elements by Magnetron Sputtering[J]. Materials and Mechanical Engineering, 2020, 44(12): 24-28,36. DOI: 10.11973/jxgccl202012004

    磁控溅射不同元素掺杂WS2薄膜的组织和纳米压痕力学性能

    Microstructure and Nanoindentation Mechanical Properties of WS2 Film withDifferent Doping Elements by Magnetron Sputtering

    • 摘要: 采用磁控溅射法在不同沉积压力(0.8,1.2 Pa)下分别制备WS2薄膜、Ti/WS2复合薄膜和La-Ti/WS2复合薄膜,研究了薄膜的组织结构和纳米压痕力学性能。结果表明:WS2薄膜呈疏松多孔结构,晶粒粗大,孔洞较多,组织致密性差;与WS2薄膜相比,Ti/WS2复合薄膜的晶粒尺寸减小,组织变得致密,掺杂镧后薄膜的晶粒尺寸进一步减小,组织更致密;镧的掺杂还降低了薄膜中硫与钨的原子比,增加了硬质钨相的相对含量,提高了薄膜的硬度和变形抗力。

       

      Abstract: The WS2 film, Ti/WS2 composite film and La-Ti/WS2 composite film were prepared by magnetron sputtering under different deposition pressures (0.8, 1.2 Pa). The microstructure and nanoindentation mechanical properties of the films were studied. The results show that the WS2 film had a loose and porous structure with coarse grains and many pores; the density of microstructure was poor. Compared with those of the WS2 film, the grain size of the Ti/WS2 composite film was reduced and the structure was densified. The doping of lanthanum further reduced the grain size of the film, and the microstructure was more compact. The doping of lanthanum also reduced the atomic ratio of sulfur to tungsten in the film, increased the relative content of the hard tungsten phase, and finally increased the hardness and deformation resistance of the film.

       

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