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    刘桂良, 何宗倍, 蔺浩然, 张瑞谦, 陈招科, 王继平. 热解碳-SiC共沉积界面SiCf/SiC Mini复合材料的制备及其拉伸行为[J]. 机械工程材料, 2021, 45(9): 35-39,50. DOI: 10.11973/jxgccl202109007
    引用本文: 刘桂良, 何宗倍, 蔺浩然, 张瑞谦, 陈招科, 王继平. 热解碳-SiC共沉积界面SiCf/SiC Mini复合材料的制备及其拉伸行为[J]. 机械工程材料, 2021, 45(9): 35-39,50. DOI: 10.11973/jxgccl202109007
    LIU Guiliang, HE Zongbei, LIN Haoran, ZHANG Ruiqian, CHEN Zhaoke, WANG Jiping. Preparation and Tensile Behavior of Mini SiCf/SiC Composites with PyC-SiC Codeposition Interface[J]. Materials and Mechanical Engineering, 2021, 45(9): 35-39,50. DOI: 10.11973/jxgccl202109007
    Citation: LIU Guiliang, HE Zongbei, LIN Haoran, ZHANG Ruiqian, CHEN Zhaoke, WANG Jiping. Preparation and Tensile Behavior of Mini SiCf/SiC Composites with PyC-SiC Codeposition Interface[J]. Materials and Mechanical Engineering, 2021, 45(9): 35-39,50. DOI: 10.11973/jxgccl202109007

    热解碳-SiC共沉积界面SiCf/SiC Mini复合材料的制备及其拉伸行为

    Preparation and Tensile Behavior of Mini SiCf/SiC Composites with PyC-SiC Codeposition Interface

    • 摘要: 以国产第三代碳化硅纤维(SiCf)为增强体,通过化学气相渗透(CVI)工艺在SiCf表面同时沉积热解碳(PyC)和SiC形成共沉积界面层,沉积时间为20~70 min,然后继续沉积SiC制备出致密的Mini SiCf/SiC复合材料,研究复合材料的界面结构和拉伸行为。结果表明:20,40,70 min沉积时间下得到共沉积界面层的平均厚度分别为500,1 100,2 100 nm,界面层厚度均匀,为单层界面;当共沉积界面层厚度为1 100 nm时,Mini复合材料的界面结合强度适中,拉伸强度最大,达到626.0 MPa,对应的断裂应变为0.45%。

       

      Abstract: With third-generation domestic silicon carbide fiber (SiCf) as reinforcement, pyrocarbon (PyC) and SiC codeposition interface layer were simultaneously deposited on the surface of SiCf by chemical vapor infiltration (CVI) with deposition time of 20-70 min. Then SiC was deposited continueously and dense Mini SiCf/SiC composites were prepared. The interface structure and teasile behavier of the composites were studied. The results show that the average thicknesses of the codeposition interface layer were 500, 1 100, 2 100 nm after deposition for 20, 40, 70 min, respectively, and the thickness of the interface layer was uniform; the interface layer was a single layer structure. When the thickness of the codeposition interface layer was 1 100 nm, the Mini composite had moderate interface bonding strength and the largest tensile strength of 626.0 MPa, and the corresponding fracture strain was 0.45%.

       

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