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    刘超, 孙旋, 王傲冰, 赵利颇, 田明. 脉冲电流对GH4169合金高温压缩变形及动态再结晶行为的影响[J]. 机械工程材料, 2022, 46(6): 26-30. DOI: 10.11973/jxgccl202206005
    引用本文: 刘超, 孙旋, 王傲冰, 赵利颇, 田明. 脉冲电流对GH4169合金高温压缩变形及动态再结晶行为的影响[J]. 机械工程材料, 2022, 46(6): 26-30. DOI: 10.11973/jxgccl202206005
    LIU Chao, SUN Xuan, WANG Aobing, ZHAO Lipo, TIAN Ming. Effect of Pulse Current on High Temperature Compression Deformation and Dynamic Recrystallization Behavior of GH4169 Alloy[J]. Materials and Mechanical Engineering, 2022, 46(6): 26-30. DOI: 10.11973/jxgccl202206005
    Citation: LIU Chao, SUN Xuan, WANG Aobing, ZHAO Lipo, TIAN Ming. Effect of Pulse Current on High Temperature Compression Deformation and Dynamic Recrystallization Behavior of GH4169 Alloy[J]. Materials and Mechanical Engineering, 2022, 46(6): 26-30. DOI: 10.11973/jxgccl202206005

    脉冲电流对GH4169合金高温压缩变形及动态再结晶行为的影响

    Effect of Pulse Current on High Temperature Compression Deformation and Dynamic Recrystallization Behavior of GH4169 Alloy

    • 摘要: 通过950℃高温压缩试验模拟实际GH4169合金锻造加工过程,研究施加不同密度(0~4.5 kA·mm-2)脉冲电流条件下合金的高温压缩变形及动态再结晶行为,并对脉冲电流的影响机制进行讨论。结果表明:在脉冲电流作用下,压缩时合金更易屈服变形,压缩变形抗力降低,且随着脉冲电流密度增大,压缩变形抗力降低程度更大,这与脉冲电流产生的电子风力促进位错运动有直接关系;随着脉冲电流密度的增大,合金发生一次再结晶后发生二次再结晶,这是因为脉冲电流可促进原子扩散,导致亚晶界迁移难度降低,从而对动态再结晶具有促进作用。

       

      Abstract: The processing of GH4169 alloy forgings was simulated by 950℃ high temperature compression test. The high temperature compression deformation and dynamic recrystallization behavior of the alloy under the conditions of pulse current with different densities (0-4.5 kA·mm-2), and the influence mechanism of pulse current was discussed. The results show that the alloy was more prone to yield during compression under the action of pulse current, and the compressive deformation resistance decreased; the decrease degree of compressive deformation resistance become more obvious with increasing pulse current density, which was directly related to the fact that the electronic wind force generated by pulse current promoted the dislocation motion. With increasing pulse current density, secondary recrystallization occurred after primary recrystallization, this was because that the pulse current could promote atom diffusion, reduce the difficulty of grain boundary migration and promote dynamic recrystallization.

       

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