Effect of Rolling Deformation Amount on Microstructure and AntibacterialProperties of Silver-Containing Copper Alloy
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摘要: 在室温下对含质量分数0.11%银的铜合金进行轧制，研究了轧制变形量（30%，50%，70%）对其组织和抗菌性能的影响。结果表明：含银铜合金的晶粒尺寸随轧制变形量的增加而减小，当轧制变形量为70%时，平均晶粒尺寸由未轧制的143 μm减小至1.4 μm，变形孪晶减少至基本消失；含银铜合金中存在纳米银颗粒，且偏聚在晶界处位错墙、位错缠结等缺陷密度较大区域，轧制后纳米银颗粒分布均匀；轧制有利于提高含银铜合金的抗菌性能，且变形量越大，抗菌性能越好，70%变形量轧制后含银铜合金与大肠杆菌悬液接触6 h时的抗菌率超过99.9%，且抗菌效果可持续12 h以上，这与提高轧制变形量可增加合金中的缺陷数量和晶界密度，促进纳米银颗粒的弥散分布有关。Abstract: Copper alloy with 0.11wt% silver was rolled at room temperature and the effect of rolling deformation amount (30%, 50%, 70%) on its structure and antimicrobial properties was studied. The results show that the grain size of the silver-containing copper alloy decreased with increasing rolling deformation. With rolling deformation amount of 70%, the average grain size decreased from 143 μm without rolling to 1.4 μm, and the deformation twins were reduted to almost vanishing. The nano-silver particles existed in silver-containing copper alloys and segregated in areas with high defect density such as dislocation wall and dislocation entanglement at grain boundaries, and after rolling nano-silver particles distributed uniformly. Rolling could improve the antimicrobial properties of silver-containing copper alloy, and the larger the deformation amount, the better the antimicrobial properties. The antimicrobial rate of the silver-containing copper alloy after rolling with 70% deformation amount in contact with Escherichia coli suspension for 6 h exceeded 99.9%, and the antimicrobial effect could last more than 12 h, which was related to the fact that increasing the rolling deformation amount could increase the number of defects and the density of grain boundaries in the alloy, and promote the dispersion distribution of nano-silver particles.
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Keywords:
- silver-containing copper alloy /
- rolling /
- microstructure /
- antibacterial property
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