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    隋明冉, 张瑜璐, 李乙庚, 李鹏宇, 南邵俊, 杜军. 硅、镍含量与制备工艺对Al-Si-Ni合金组织和热学性能的影响[J]. 机械工程材料, 2024, 48(9): 32-37. DOI: 10.11973/jxgccl230347
    引用本文: 隋明冉, 张瑜璐, 李乙庚, 李鹏宇, 南邵俊, 杜军. 硅、镍含量与制备工艺对Al-Si-Ni合金组织和热学性能的影响[J]. 机械工程材料, 2024, 48(9): 32-37. DOI: 10.11973/jxgccl230347
    SUI Mingran, ZHANG Yulu, LI Yigeng, LI Pengyu, NAN Shaojun, DU Jun. Effects of Si and Ni Content and Preparation Process on Microstructure and Thermal Properties of Al-Si-Ni Alloy[J]. Materials and Mechanical Engineering, 2024, 48(9): 32-37. DOI: 10.11973/jxgccl230347
    Citation: SUI Mingran, ZHANG Yulu, LI Yigeng, LI Pengyu, NAN Shaojun, DU Jun. Effects of Si and Ni Content and Preparation Process on Microstructure and Thermal Properties of Al-Si-Ni Alloy[J]. Materials and Mechanical Engineering, 2024, 48(9): 32-37. DOI: 10.11973/jxgccl230347

    硅、镍含量与制备工艺对Al-Si-Ni合金组织和热学性能的影响

    Effects of Si and Ni Content and Preparation Process on Microstructure and Thermal Properties of Al-Si-Ni Alloy

    • 摘要: 利用普通凝固、水冷铜模亚快速凝固和水冷铜模亚快速凝固复合热处理(520 ℃×6 h)3种工艺,分别制备了Al-11Si-5Ni合金、Al-22Si-10Ni合金和Al-33Si-15Ni合金,研究了不同合金的显微组织和热学性能。结果表明:Al-11Si-5Ni共晶合金在凝固过程中仅发生Al-Si-Al3Ni三元共晶反应,形成由α-Al相、共晶硅相和共晶Al3N相组成的三元共晶组织;Al-22Si-10Ni合金与Al-33Si-15Ni合金为过共晶合金,组织由初生硅相、初生Al3N相和三元共晶组织组成,其凝固过程分为初生硅相析出、初生硅相与Al3Ni相的共同析出以及Al-Si-Al3Ni三元共晶反应3个阶段;随着镍、硅含量的同步增加,初生硅相与Al3Ni相粗化;与普通凝固工艺相比,水冷铜模亚快速凝固工艺可以细化合金组织,而热处理使共晶硅相与共晶Al3Ni相发生球化。随着硅、镍含量的同步增加,合金的热导率与热膨胀系数均下降,而水冷铜模亚快速凝固复合热处理可以有效提升合金的热导率。水冷铜模亚快速凝固复合热处理工艺制备的Al-22Si-10Ni合金具有优异的综合性能,其室温热导率为129.9 W·m−1·K−1,100 ℃热膨胀系数为13.8×10−6 K−1,25~100 ℃平均热膨胀系数为12.9×10−6 K−1

       

      Abstract: Three kinds of alloys, Al-11Si-5Ni, Al-22Si-10Ni and Al-33Si-15Ni, were prepared by ordinary solidification, water-cooled copper mold sub-rapid solidification and water-cooled copper mold sub-rapid solidification combined with heat treatment (520 ℃×6 h). The microstructures and thermal properties of the alloys were studied. The results show that only Al-Si-Al3Ni ternary eutectic reaction occurred in the solidification process of Al-11Si-5Ni eutectic alloy, and the microstructure was ternary eutectic structure composed of α-Al, eutectic silicon and eutectic Al3N phases. The Al-22Si-10Ni and Al-33Si-15Ni alloys were hypereutectic alloys, the microstructure consisted of primary silicor phase, primary Al3Ni phase and ternary eutectic structure, and the solidification process was divided into three stages: the primary silicon phase precipitation, the primary silicon and Al3Ni phase co-precipitation, and Al-Si-Al3Ni ternary eutectic reaction. With the simultaneous increase of Ni and Si content, primary silicon and Al3Ni phases were coarsened. Compared with the ordinary solidification process, the water-cooled copper mold sub-rapid solidification process could refine the alloy structure, and the heat treatment made the eutectic silicon phase and the eutectic Al3Ni phase spheroidize. With the simultaneous increase of the content of Ni and Si, the alloy's thermal conductivity and the thermal expansion coefficient decreased. The water-cooled copper mold sub-rapid solidification combined with heat treatment could effectively improve the thermal conductivity of the alloy. Al-22Si-10Ni alloy prepared by the water-cooled copper mold subrapid solidification combined with heat treatment had the best comprehensive performance with the room temperature thermal conductivity of 129.9 W · m−1 · K−1, the thermal expansion coefficient at 100 ℃ of 13.8×10−6 K−1, and the average thermal expansion coefficient in the temperature range of 25–100 ℃ of 12.9×10−6 K−1.

       

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