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    等通道转角挤压变形超细晶纯铜的组织与性能

    Microstructure and Properties of Ultrafine-Grained Pure Copper Based on Equal Channel Angular Pressing Deformation

    • 摘要: 在室温下采用BC路径(每道次挤压时将试样绕其轴线沿同一方向旋转90°)对T2纯铜进行4道次等通道转角挤压(ECAP),研究了不同道次ECAP变形前后纯铜的显微组织、力学性能和耐腐蚀性能。结果表明:经过1道次ECAP变形后,纯铜内部形成粗大的条带状组织,与剪切应力方向呈30°~45°;经过4道次ECAP变形后,纯铜晶粒发生显著破碎与细化,出现了大量的超细等轴晶组织,平均晶粒尺寸约为0.96 μm;4道次ECAP变形后纯铜的显微硬度与抗拉强度较未变形显著提高,增幅分别为43.8%和51.5%;随着ECAP道次的增加,纯铜的溶液电阻、电荷转移电阻和极化电阻均增大,开路电位和自腐蚀电位均升高,自腐蚀电流密度减小,耐腐蚀性能提升。

       

      Abstract: Four-pass equal channel angular pressing (ECAP) was performed on T2 pure copper by using the BC pathway (the specimen was rotated 90° in the same direction around its axis at each ECAP) at room temperature, the microstructure, mechanical properties and corrosion resistance of the pure copper before and after ECAP deformation for different passes (one-pass, four-pass) were studied. The results show that after one-pass ECAP deformation, a large banded structure was formed in the pure copper, and the direction of the band was at 30°–45° to the direction of shear stresses. After four-pass ECAP deformation, the pure copper grains were broken and refined significantly, a large number of ultrafine-equiaxed grained structures appeared, and the average grain size was about 0.96 μm. The microhardness and tensile strength of the pure copper after four-pass ECAP deformation significantly increased by 43.8% and 51.5%, respectively. With the increase of ECAP pass, the solution resistance, charge transfer resistance and polarization resistance of the pure copper increased, the open circuit potential and self-corrosion potential increased, and the self-corrosion current density decreased, indicating the corrosion resistance was improved.

       

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