Abstract: Epoxy resin is the most widely used plastic-based electronic packaging material, but its low thermal conductivity limits its application in the field of electronic packaging. Through the modification of resin and the addition of high thermal conductivity filler can effectively improve the thermal conductivity of epoxy resin. The types and research progress of epoxy resin matrix composites are summarized. The various performance requirements of electronic packaging on epoxy resin matrix composites are introduced, including high thermal conductivity, insulation, low dielectric properties and flame retardancy. The modification methods of epoxy resin matrix composites with different properties are reviewed. Finally, it outlines future directions for epoxy resin matrix composites for electronic packaging.