Abstract: With the continuous miniaturization and integration of electronic devices, their power density increases sharply, and heat accumulation is being exacerbated. Thermal interface materials can ensure good heat conduction between package and heat dissipation device to dissipating heat quickly, preventing performance degradation of electronic devices because of overheating. The composition and thermal conductivity mechanism of heat-conducting silicone grease, a common thermal interface material, are reviewed. The factors affecting the thermal conductivity of heat-conducting silicone grease are summarized, including the type, morphology and particle size distribution of heat-conducting fillers, and the compatibility between heat-conducting fillers and polymer matrix. The methods to enhance the thermal conductivity of heat-conducting silicone grease are introduced from aspects of the synergistic effect and surface modification of heat-conducting fillers. In the future, the comprehensive performance of heat-conducting silicone grease should be further improved by deepening surface modification technology, optimizing the synergistic effect of heat-conducting fillers and strengthening the construction of theoretical prediction model.