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    端子表面粗糙度对超声波焊接铜线/紫铜端子接头拉伸性能的影响

    Effect of Terminal Surface Roughness on Tensile Properties of Ultrasonic Welding Copper Wire/Violet Copper Terminal Joint

    • 摘要: 利用砂纸打磨T2紫铜端子表面以获得不同的表面粗糙度(1.80,1.15,0.62,0.36,0.14 μm),采用超声波焊接方法对EVR25 mm2铜线和紫铜端子进行焊接,研究了端子表面粗糙度对接头成形质量和拉伸性能的影响。结果表明:随着端子表面粗糙度由1.80 μm降低至0.14 μm,接头的孔隙率由11.76%降低至8.15%,铜丝之间以及铜线/端子界面处的孔隙减少,界面结合更加紧密,结合形式由点连接与线连接转变为线连接与面连接,接头的成形质量提高;随着端子表面粗糙度降低,拉伸过程中接头的平均峰值载荷升高,铜线在端子上的粘连程度增强,接头的失效形式由以界面拉脱为主向以铜线大量粘连为主转变。

       

      Abstract: The surface of T2 violet copper terminals was ground with sandpaper to obtain different surface roughness (1.80, 1.15, 0.62, 0.36, 0.14 μm). The EVR25 mm2 copper wires and violet copper terminals were welded by ultrasonic welding. The influence of terminal surface roughness on the forming quality and tensile properties of the joint was studied. The results show that as the surface roughness of the terminals decreased from 1.80 μm to 0.14 μm, the porosity of the joints decreased from 11.76% to 8.15%. With decreasing surface roughness of the terminals, the porosity between copper silks and at the copper wire/terminal interface decreased, the bonding between interface became tighter, and the combination form changed from point connection and line connection to line connection and surface connection; the forming quality of the joint improved. With decreasing the surface roughness of the terminals, the average peak load of the joint during the tension increased, the adhesion degree of copper wire on the terminal intensified, and the failure form of the joint changed from mainly interface pull-off to mainly large-scale adhesion of copper wire.

       

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