Abstract: As a core material of the third-generation semiconductor, monocrystalline SiC is widely used in the component preparation of micro/nano-electromechanical systems, sensors and flexible electronic devices. The micro and nano mechanical properties of monocrystalline SiC are different from those at the macroscopic scale, showing significant size effects. Moreover, its high hardness and brittleness lead to low efficiency, high cost and poor quality in micro and nano processing. Studying the micro and nano mechanical properties and material removal mechanism of monocrystalline SiC is the key to achieving efficient and high-precision micro and nano processing and further improving the functionality and reliability of devices. The micro and nano mechanical performance testing methods are summarized, the types of micro and nano processing material removal mechanisms are classified, the research progress of test and simulation studies on the micro and nano processing material removal mechanisms are reviewed, the existing problems in the micro and nano processing of monocrystalline SiC are proposed and the future development directions are prospected.