高级检索

    工艺参数对真空扩散焊接GH4099高温合金-T2紫铜异种金属接头组织及性能的影响

    Influence of Process Parameters on Microstructure and Properties of Vacuum Diffusion Welding GH4099 Superalloy-T2 Copper Dissimilar Metal Joint

    • 摘要: 采用真空扩散焊接对GH4099高温合金与T2紫铜进行异种金属连接,研究了扩散温度(860,890,920 ℃)、扩散压力(1.5,2.8,4.2 MPa)、保温时间(0.5,1.0,2.0 h)对接头成形质量、硬度和拉伸性能的影响,确定了真空扩散焊接最佳工艺参数范围。结果表明:当扩散温度为860 ℃时,焊接界面明显且出现较多连续分布的孔洞缺陷,成形质量较差,当扩散温度为890 ℃及以上时无明显孔洞缺陷,焊合质量高。随着扩散温度升高或扩散压力增加,连接界面扩散层厚度增大;随着保温时间延长,扩散层呈早期快速增厚、随后受阻、再增厚的分阶段演化特征。随着扩散温度升高,扩散层硬度增大,接头抗拉强度先增大后减小;扩散压力对硬度和抗拉强度影响较小;随着保温时间延长,抗拉强度增大。真空扩散焊接最佳工艺参数范围为扩散温度890 ℃、保温时间2 h、扩散压力1.5~4.2 MPa,此时接头连接界面呈波形,扩散层中心生成富铜固溶体、富铬固溶体以及Ni-Si硬脆相,扩散层厚度在13~20 μm,抗拉强度高于紫铜母材。

       

      Abstract: The dissimilar maetal joining of GH4099 high-temperature alloy and T2 copper was carried out by vacuum diffusion welding. The effects of diffusion temperature (860, 890, 920 ℃), diffusion pressure (1.5, 2.8, 4.2 MPa), and holding time (0.5, 1.0, 2.0 h) on the formation quality, hardness, and tensile properties of the joint were studied. The optimal process parameters range for vacuum diffusion welding was determined. The results show that at the diffusion temperature of 860 ℃, the welding interface was obvious and there were many continuous distributed hole defects, resulting in poor formation quality. At the diffusion temperature of 890 ℃ or above, there were no obvious hole defects, and the welding quality was high. With the increase of diffusion temperature or diffusion pressure, the thickness of the diffusion layer at the connection interface increased. With the extension of holding time, the diffusion layer showed a staged evolution characteristic of rapid early thickening, then blocked, and then thickening again. With the increase of diffusion temperature, the hardness of the diffusion layer increased, and the tensile strength of the joint first increased and then decreased. The influence of diffusion pressure on hardness and tensile strength was small. With the extension of holding time, the tensile strength increased. The optimal process parameter range for vacuum diffusion welding was diffusion temperature of 890 ℃, holding time of 2 h, and diffusion pressure of 1.5−4.2 MPa. At this time, the joint interface at the connection showed a wavy shape, the center of the diffusion layer generated copper-rich solid solution, chromium-rich solid solution, and Ni-Si hard brittle phase, and the thickness of the diffusion layer was 13−20 μm, with the tensile strength higher than the copper base material.

       

    /

    返回文章
    返回