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    基于分子动力学的锡青铜/钢扩散连接模拟

    Simulation of Tin Bronze/Steel Diffusion Bonding by Molecular Dynamics

    • 摘要: 建立了锡青铜/钢扩散连接分子动力学模型,从原子尺度研究了不同扩散温度(1 073~1 173 K)下保温8 ns时锡青铜/钢的扩散行为,分析了扩散机理。结果表明:模拟得到不同温度扩散连接过程中,锡青铜/钢扩散界面均出现非对称性扩散现象,铁原子向铜中扩散的数量更多、距离更远。随着扩散温度升高,扩散层厚度增大,铁和铜原子的均方位移增大。在1 103 K下保温1 h制备的扩散焊接接头扩散界面呈凹凸形互嵌形貌,界面处形成Fe-Cu固溶体,扩散层厚度为5.0 μm,抗拉强度达到260 MPa;锡青铜和钢之间元素发生互扩散,铁在锡青铜中的扩散距离较远,而铜仅出现在界面附近的钢中。

       

      Abstract: The tin bronze/steel diffusion bonding molecular dynamics model was established. The diffusion behavior of tin bronze/steel at different diffusion temperatures (1 073−1173 K) for 8 ns at the atomic scale was studied, and the diffusion mechanism was analyzed. The results show that under different diffusion temperatures, asymmetric diffusion phenomena appeared at the diffusion interface between tin bronze and steel by simulation, namely more iron atoms diffused into copper and the diffusion distance was longer. With the increase of diffusion temperature, the thickness of the diffusion layer and the mean square displacement of iron and copper atoms both increased. The diffusion bonding joint prepared at 1103 K for 1 h had a concave-convex interlocking morphology at the diffusion interface, and Fe-Cu solid solution was formed at the interface. The thickness of diffusion layer at 1103 K was 5.0 μm, and the tensile strength reached 260 MPa. Interdiffusion of elements occurred between tin bronze and steel. The diffusion distance of iron in tin bronze was relatively long, while copper was only present in the steel near the interface.

       

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