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    基于分子动力学的锡青铜/钢扩散连接模拟

    Simulation of Tin Bronze/Steel Diffusion Bonding According to Molecular Dynamics

    • 摘要: 建立了锡青铜/钢扩散连接分子动力学模型,从原子尺度研究了不同扩散温度(1 073,1 123,1 148,1 172 K)下保温8 ns后锡青铜/钢的扩散行为,分析了扩散机理,并进行了试验验证。结果表明:模拟和试验结果一致性好,不同扩散温度下,锡青铜/钢扩散界面均出现非对称性扩散现象,相比铜原子向铁中扩散,铁原子向铜中扩散的数量更多、距离更远;铜原子在界面处的扩散激活能小于铁原子,扩散速率较大,但铁原子间的键合作用更难被打破,铜原子难以深入铁晶格内部;铜更容易产生晶格缺陷,铁原子缓慢扩散并深入至铜内部。扩散温度是影响原子扩散行为的重要参数,随着扩散温度升高,扩散层厚度增大,铁和铜原子的均方位移增大。在1 103 K下保温8 ns制备的扩散焊接接头扩散界面呈凹凸形互嵌形貌,少数铜原子扩散进钢基体,形成Fe-Cu固溶体,扩散层最厚(5.0 μm),抗拉强度最大(260 MPa)。

       

      Abstract: The tin bronze/steel diffusion bonding molecular dynamics model was established. The diffusion behavior of tin bronze/steel at different diffusion temperatures (1 073, 1 123, 1 148, 1172 K) after holding for 8 ns at the atomic scale was studied, the diffusion mechanism was analyzed, and the model was verified by experiments. The results show that the simulation and experimental results were highly consistent: under different diffusion temperatures, asymmetric diffusion phenomena occurred at the diffusion interface between tin bronze and steel, compared with the diffusion of copper atoms into iron, more iron atoms diffused into copper and the diffusion distance was longer. The diffusion activation energy of copper atoms at the interface was smaller than that of iron atoms, and the diffusion rate was larger, but the bonding between iron atoms was more difficult to break, and copper atoms were difficult to penetrate into the interior of the iron lattice. Copper was more prone to lattice defects, and iron atoms diffused slowly and deeply into the copper interior. Diffusion temperature was an important parameter affecting the atomic diffusion behavior. With the increase of diffusion temperature, the thickness of the diffusion layer and the mean square displacement of iron and copper atoms both increased. The diffusion bonding joint prepared at 1103 K for 8 ns had a concave-convex interlocking morphology at the diffusion interface, with a few copper atoms diffusing into the steel matrix to form Fe-Cu solid solution. The diffusion layer was the thickest (5.0 μm), and the tensile strength was the largest (260 MPa).

       

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