衬底材料和溅射方法对CNx薄膜膜基结合力的影响

详细信息

Effect of Underlay Materials and Sputtering Method on Adhesive Force of CNx Films

摘要: 分别将W18Cr4V高速钢和YG8硬质合金作为衬底材料,用直流磁控溅射和射频磁控溅射法制备了CNx薄膜,用划痕法测定了薄膜和衬底材料之间的膜基结合力.结果表明:YG8硬质合金作为衬底材料时薄膜的膜基结合力较高;对YG8硬质合金衬底材料进行适当的腐蚀处理或溅射一层TiN中间层,薄膜的膜基结合力明显提高;对于两种衬底材料,射频磁控溅射法制备的薄膜膜基结合力明显高于直流磁控溅射法制备的薄膜.
- 磁控溅射 /
- 衬底 /
- CNx薄膜 /
- 结合力
Abstract: CNx films were prepared by DC and RF magnetron sputtering with W18Cr4V high-speed steel and YG8 hard alloy underlay.The adhesive force of CNx films was studied by scratch test.The research indicate that the adhesive force of CNx films is high when YG8 hard alloy was applied as underlay.The adhesive force of CNx films can be enhanced when YG8 underlay is corroded or TiN middle transition layer is added.RF magnetron sputtering is in favor of the adhesive force of CNx films for both W18Cr4V and YG8 underlay.
- magnetron sputtering /
- underlay /
- CNx film /
- adhesive force

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