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    高晓明, 孙嘉奕, 胡明, 翁立军, 伏彦龙, 杨军, 谭洪根, 张良俊. 低温沉积银和银铜薄膜的耐原子氧性能[J]. 机械工程材料, 2013, 37(11): 55-59.
    引用本文: 高晓明, 孙嘉奕, 胡明, 翁立军, 伏彦龙, 杨军, 谭洪根, 张良俊. 低温沉积银和银铜薄膜的耐原子氧性能[J]. 机械工程材料, 2013, 37(11): 55-59.
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    GAO Xiao-ming, SUN Jia-yi, HU Ming, WENG Li-jun, FU Yan-long, YANG Jun, TAN Hong-gen, ZHANG Liang-jun. Atomic Oxygen Resistant Behavior of Ag and Ag-Cu Films Deposited at Low Temperature[J]. Materials and Mechanical Engineering, 2013, 37(11): 55-59.
    Citation: GAO Xiao-ming, SUN Jia-yi, HU Ming, WENG Li-jun, FU Yan-long, YANG Jun, TAN Hong-gen, ZHANG Liang-jun. Atomic Oxygen Resistant Behavior of Ag and Ag-Cu Films Deposited at Low Temperature[J]. Materials and Mechanical Engineering, 2013, 37(11): 55-59.
    shu

    低温沉积银和银铜薄膜的耐原子氧性能

    Atomic Oxygen Resistant Behavior of Ag and Ag-Cu Films Deposited at Low Temperature

      摘要
    • 摘要: 采用多弧离子镀方法在低温(173 K)下沉积了银和银铜薄膜, 通过地面原子氧模拟试验系统考察了薄膜的耐原子氧性能, 通过X射线衍射仪(XRD)和原子力显微镜(AFM)对薄膜的结构和耐原子氧性能进行了分析, 并与室温下沉积的银薄膜进行了比较。结果表明: 低温沉积和铜元素合金化, 可减小银薄膜的晶粒尺寸, 并提高其结构致密性; 低温沉积的银铜薄膜表现出细密的结构, 这有利于抑制原子氧对薄膜的氧化, 从而使其比室温及低温下沉积的银薄膜具有更好的耐原子氧性能。

       

      Abstract: Ag and Ag-Cu films were deposited at low temperature (173 K) by arc ion plating (AIP). Atomic oxygen (AO) irradiation experiments were conducted using a ground AO simulation facility. The structure and AO resistant behavior of the films were investigated by X-ray diffraction (XRD) and atomic force microscope (AFM) and compared with Ag film deposited at room temperature. The results show that crystallite size of Ag film was reduced by low temperature deposition and alloying with Cu, and its structure became more densified. So the Ag-Cu film deposited at low temperature had a dense structure beneficial for resisting oxidation of films by oxygen, and exhibited much better AO resistant behavior than that of the Ag film deposited at room temperature or at low temperature after the AO irradiation.

       

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