Abstract: The flow stress behavior and microstructure change of CuNiSiP alloy during hot compression deformation process were studied by isothermal compression test on Gleeble-1500D thermal-mechanical simulator.The results show that both strain rate and deforming temperature had great effect on the dynamic recrystallization of the alloy.When the strain rates were 0.1 and 0.01 s-1,recrystallization could happened when the temperature was higher than 650 ℃.However,when the strain rates were 1 and 5 s-1,the recrystallization could happened only when the temperature was higher than 700 ℃.The higher the temperature,and the smaller the strain rate,the easier the dynamic recrystallization.The hot deformation activation energy of the CuNiSiP alloy was gained by Arrhenius hyperbolic sine function to be Q=485.6 kJ·mol-1.