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    朱建华, 刘磊, 赵海军, 沈彬, 胡文彬. 纳米碳化硅增强铜基复合材料的组织及其磨损性能[J]. 机械工程材料, 2006, 30(10): 46-48.
    引用本文: 朱建华, 刘磊, 赵海军, 沈彬, 胡文彬. 纳米碳化硅增强铜基复合材料的组织及其磨损性能[J]. 机械工程材料, 2006, 30(10): 46-48.
    ZHU Jian-hua, LIU Lei, ZHAO Hai-jun, SHEN Bin, HU Wen-bin. Microstructure and Wear Resistance of Cu/nano-SiC Composite[J]. Materials and Mechanical Engineering, 2006, 30(10): 46-48.
    Citation: ZHU Jian-hua, LIU Lei, ZHAO Hai-jun, SHEN Bin, HU Wen-bin. Microstructure and Wear Resistance of Cu/nano-SiC Composite[J]. Materials and Mechanical Engineering, 2006, 30(10): 46-48.

    纳米碳化硅增强铜基复合材料的组织及其磨损性能

    Microstructure and Wear Resistance of Cu/nano-SiC Composite

    • 摘要: 为了探求在常温下制备颗粒弥散增强金属基复合材料的方法,采用复合电铸工艺在室温下制备了纳米碳化硅粒子弥散增强铜基复合材料,对其表面形貌、微观组织结构进行了观察,对显微硬度、磨损性能及导电性能进行了测试.结果表明:纳米碳化硅粒子均匀弥散分布在铜基体中,且与基体结合良好;复合材料表面平整、细密;与电沉积纯铜材料相比,其显微硬度明显提高,磨损性能改善,导电性能下降幅度不大.

       

      Abstract: In order to explorie a method of preparing particles reinforced metal matrix composites at room temperature,the composite electroforming technique was used to fabricate nano-sized carbide silicon particles (nano-SiC) reinforced copper composite.The surface morphology,microstructure,microhardness,wear resistance and electrical resistivity (Er) were investigated.The nano-SiC was embedded in copper matrix uniformly and tightly.The surface of composite was smooth,fine and compact.The composite exhibited higher microhardness and better wear resistance than pure copper deposit,and the change range of Er was small.

       

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