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    余祖孝, 郝世雄, 刘东亮, 梁鹏飞. 添加剂对化学镀镍-钨-钼-磷镀层性能的影响[J]. 机械工程材料, 2008, 32(8): 71-73.
    引用本文: 余祖孝, 郝世雄, 刘东亮, 梁鹏飞. 添加剂对化学镀镍-钨-钼-磷镀层性能的影响[J]. 机械工程材料, 2008, 32(8): 71-73.
    YU Zu-xiao, HAO Shi-xiong, LIU Dong-liang, LIANG Peng-fei. Influence of Additives on Coating Properties of Electroless Ni-W-Mo-P Alloy Plating[J]. Materials and Mechanical Engineering, 2008, 32(8): 71-73.
    Citation: YU Zu-xiao, HAO Shi-xiong, LIU Dong-liang, LIANG Peng-fei. Influence of Additives on Coating Properties of Electroless Ni-W-Mo-P Alloy Plating[J]. Materials and Mechanical Engineering, 2008, 32(8): 71-73.

    添加剂对化学镀镍-钨-钼-磷镀层性能的影响

    Influence of Additives on Coating Properties of Electroless Ni-W-Mo-P Alloy Plating

    • 摘要: 为了提高化学镀镍-钨-钼-磷工艺的镀速、镀层的硬度和耐腐蚀性能,用磁性测厚仪、失重法、显微硬度仪等研究了加速剂、缓冲剂、稳定剂、表面活性剂对镍-钨-钼-磷镀层镀速、硬度、孔蚀率、耐腐蚀性能和形貌的影响.结果表明:最佳添加剂配方为10 g·L-1硫酸铵(加速剂),20 g·L-1硼酸(缓冲剂),2 mg·L-1碘酸钾(稳定剂),50 mg·L-1十二烷基苯磺酸钠(表面活性剂);此时镀速较高,镀层性能较好.

       

      Abstract: In order to improve the deposition rate,hardness and anti-corrosion properties of electroless Ni-W-Mo-P plating,effects of accelerator,buffer,stabilizer and surfactant on the deposition rate,hardness,corrosion resistance and morphology of electroless Ni-W-Mo-P plating were studied using magnetic-type thickness measurement,weight loss method,micro-hardness testing etc.The optimum additives were composed of 10 g·L-1 (NH4)2SO4 (accelerator),20 g·L-1 H3BO3(buffer),2 mg·L-1 KIO3(stabilizer) and 50 mg·L-1 C18H28O3SHNa (surfactant).

       

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