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高体积分数SiCp增强6063Al基复合材料的真空加压钎焊

王鹏, 程东锋, 牛济泰

王鹏, 程东锋, 牛济泰. 高体积分数SiCp增强6063Al基复合材料的真空加压钎焊[J]. 机械工程材料, 2014, 38(9): 34-38.
引用本文: 王鹏, 程东锋, 牛济泰. 高体积分数SiCp增强6063Al基复合材料的真空加压钎焊[J]. 机械工程材料, 2014, 38(9): 34-38.
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WANG Peng, CHENG Dong-feng, NIU Ji-tai. Vacuum Brazing with Pressure of High-Volume-Fraction SiCp Reinforced 6063 Al-based Composite[J]. Materials and Mechanical Engineering, 2014, 38(9): 34-38.
Citation: WANG Peng, CHENG Dong-feng, NIU Ji-tai. Vacuum Brazing with Pressure of High-Volume-Fraction SiCp Reinforced 6063 Al-based Composite[J]. Materials and Mechanical Engineering, 2014, 38(9): 34-38.
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高体积分数SiCp增强6063Al基复合材料的真空加压钎焊

  • 1.

    河南理工大学材料科学与工程学院, 焦作 454000

  • 2.

    河南晶泰航空航天高新材料科技有限公司, 焦作 454000

基金项目: 

国家自然科学基金资助项目(51245008)

科技部中小型企业创新基金资助项目(11C26214105167)

详细信息
    作者简介:

    王鹏(1988-), 男, 河南商丘人, 硕士研究生。

  • 中图分类号: TG454

Vacuum Brazing with Pressure of High-Volume-Fraction SiCp Reinforced 6063 Al-based Composite

摘要

    摘要
  • 摘要: 在580 ℃、保温40 min、压力为4 kPa的钎焊条件下, 采用Al70-Cu22.3-Si6.1-Mg1.6膏状钎料对增强相体积分数为60%的SiCp/6063Al复合材料进行真空加压钎焊, 通过扫描电镜和剪切试验等研究了钎料对复合材料基体及SiC增强相的润湿机理以及钎焊接头的显微组织、剪切断口形貌。结果表明: 在试验条件下, 钎料对复合材料的润湿性较高, 可通过扩散及机械压渗作用与基体、SiC颗粒分别形成冶金结合和机械锁合, 接头的抗剪强度均值为71.6 MPa; 钎料与基体合金的反应界面消失, 钎料对大块SiC增强相的润湿性一般, 二者之间存在较小的间隙; 断裂发生在钎料层以及钎料与复合材料界面的母材侧。
    Abstract: One soldering paste of aluminum based ball-grinding powders containing 22.3wt.%Cu, 6.1wt.%Si, 1.6wt.%Mg was used to brazing the 60vol.%SiCp/6063Al composite under the brazing condition of 580 ℃, holding for 40 min and pressure of 4 kPa. Via SEM and shearing test, the wetting mechanism of soldering paste on the composite matrix and SiC particles, and the shear fracture morphology and microstructure of soldered joints were investigated. The results reveal that this solder alloy had a good wettability to the composite, the average shear strength was 71.6 MPa because of forming metallurgical bonding and mechanical interlocking respectively by diffusion and mechanical penetration. What′s more, the interface between the solder and the matrix alloy disappeared, and the solder had common wetting on bigger SiC particles for some small gaps between them. The fracture surface indicated the fracture occurred inside the solder alloy and the base material side of the joining interface between the solder and the composite.
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    • 参考文献(20)
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出版历程
  • 收稿日期:  2014-07-30
  • 刊出日期:  2014-09-19

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