Abstract: One soldering paste of aluminum based ball-grinding powders containing 22.3wt.%Cu, 6.1wt.%Si, 1.6wt.%Mg was used to brazing the 60vol.%SiCp/6063Al composite under the brazing condition of 580 ℃, holding for 40 min and pressure of 4 kPa. Via SEM and shearing test, the wetting mechanism of soldering paste on the composite matrix and SiC particles, and the shear fracture morphology and microstructure of soldered joints were investigated. The results reveal that this solder alloy had a good wettability to the composite, the average shear strength was 71.6 MPa because of forming metallurgical bonding and mechanical interlocking respectively by diffusion and mechanical penetration. What′s more, the interface between the solder and the matrix alloy disappeared, and the solder had common wetting on bigger SiC particles for some small gaps between them. The fracture surface indicated the fracture occurred inside the solder alloy and the base material side of the joining interface between the solder and the composite.