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    赵国际, 张柯柯, 韩丽娟, 张鑫. 快速凝固态Sn2.5Ag0.7Cu钎料钎焊接头的显微组织[J]. 机械工程材料, 2009, 33(9): 44-46.
    引用本文: 赵国际, 张柯柯, 韩丽娟, 张鑫. 快速凝固态Sn2.5Ag0.7Cu钎料钎焊接头的显微组织[J]. 机械工程材料, 2009, 33(9): 44-46.
    ZHAO Guo-ji, ZHANG Ke-ke, HAN Li-juan, ZHANG Xin. Microstructure of Soldering Joint of Rapidly Solidified Sn2.5Ag0.7Cu Solder Alloy[J]. Materials and Mechanical Engineering, 2009, 33(9): 44-46.
    Citation: ZHAO Guo-ji, ZHANG Ke-ke, HAN Li-juan, ZHANG Xin. Microstructure of Soldering Joint of Rapidly Solidified Sn2.5Ag0.7Cu Solder Alloy[J]. Materials and Mechanical Engineering, 2009, 33(9): 44-46.

    快速凝固态Sn2.5Ag0.7Cu钎料钎焊接头的显微组织

    Microstructure of Soldering Joint of Rapidly Solidified Sn2.5Ag0.7Cu Solder Alloy

    • 摘要: 采用单辊法制备了快速凝固态Sn2.5Ag0.7Cu钎料合金,在相同钎焊工艺条件下,用扫描电镜及能谱仪、拉伸试验机研究了普通和快速凝固态钎料对紫铜板钎焊接头的组织、断口形貌、界面化合物和接头性能.结果表明:与普通钎料相比,快速凝固态钎料钎焊接头组织细化,初生β-Sn相尺寸减小而数量增多、共晶组织明显减少,并且初生相与共晶组织界线变得模糊;剪切断裂时形成的韧窝更多,钎焊接头的韧性得到提高.

       

      Abstract: Rapidly solidified Sn2.5Ag0.7Cu solder alloy was prepared by single roller process.The effects of normal state and the rapidly solidified soldering on microstructure,fracture morphology,interfacial compound and properties of the purple copper joints were investigated by using SEM,EDS and tensile tester.The results show that compared with the normal state solder alloy,the joint microstructure obtained by brazing with the solidification solder was refined.The primary phase size of β-Sn decreased and its amount increased.The eutectic structure decreased obviously,and the boundary between the primary phase and eutectic phase got fuzzy.There were more dimples formed during shear fracture.The toughness of soldering joints was improved.

       

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