连接温度对TA2钛板瞬时液相扩散连接接头组织和性能的影响
Effects of Bonding Temperature on Microstructure and Properties of TA2 Transient Liquid Phase Bonded Titanium Plate Joints
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摘要: 利用铜镍锡磷系非晶合金箔作为中间层, 使用氩气保护, 在不同的连接温度采用瞬时液相扩散焊对TA2钛板进行了连接, 并通过光学显微镜、显微硬度仪和材料试验机研究了连接温度对接头组织、显微硬度和剪切强度的影响。结果表明: 连接温度低于840 ℃时, 液态中间层等温凝固没有完成, 能观察到残留的中间层; 随着连接温度的升高, 原子扩散加快, 残留中间层逐渐减少; 870 ℃时, 连接接头组织全部为固溶体; 连接温度为850 ℃时, 连接接头具有最高的剪切强度, 约为180 MPa。Abstract: Titanium TA2 plates were joined by transient liquid phase bonding at different bonding temperatures in argon atmosphere, using Cu-Ni-Sn-P amorphous foils as interlayer. Influence of bonding temperature on the microstructure, micro-hardness and shear strength of the joints were investigated by an optical microscope, a micro-hardness tester and a material tester. The results show that the isothermal solidification of the liquid interlayer did not complete at the bonding temperature lower than 840 ℃, and the remaining interlayer could be observed. Atomic diffusion speeded up and the remaining interlayer reduced gradually with the increase of bonding temperature; the microstructure of the joints were all solid solution at 870 ℃. The joints had the highest shear strength around 180 MPa when the bonding temperature was 850 ℃.