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    李茸, 刘祥萱, 王煊军. 以次亚磷酸钠为还原剂的ABS塑料室温镍-磷化学镀工艺[J]. 机械工程材料, 2008, 32(7): 46-48.
    引用本文: 李茸, 刘祥萱, 王煊军. 以次亚磷酸钠为还原剂的ABS塑料室温镍-磷化学镀工艺[J]. 机械工程材料, 2008, 32(7): 46-48.
    LI Rong, LIU Xiang-xuan, WANG Xuan-jun. Electroless Ni-P Plating on ABS Plastic Substrate with Sodium Hypophosphite as Reductant at Room Temperature[J]. Materials and Mechanical Engineering, 2008, 32(7): 46-48.
    Citation: LI Rong, LIU Xiang-xuan, WANG Xuan-jun. Electroless Ni-P Plating on ABS Plastic Substrate with Sodium Hypophosphite as Reductant at Room Temperature[J]. Materials and Mechanical Engineering, 2008, 32(7): 46-48.

    以次亚磷酸钠为还原剂的ABS塑料室温镍-磷化学镀工艺

    Electroless Ni-P Plating on ABS Plastic Substrate with Sodium Hypophosphite as Reductant at Room Temperature

    • 摘要: 为提高ABS塑料镍-磷镀层的表面质量,研究了以次亚磷酸钠为还原剂的室温碱性化学镀工艺,并对工艺进行了优化,对优化工艺制备的镀层性能进行了表征.结果表明:优化的镀液配方为28 g·L-1硫酸镍,27 g·L-1次亚磷酸钠,50 g·L-1柠檬酸钠,50 g·L-1氯化铵,0.002 5 g·L-1十二烷基苯磺酸钠,pH值8.5~9,温度25~30℃;镀层厚度达到10 μm时,其平整度、附着力较好,目测光亮度可达1级,硬度较低,方块电阻小于10 μΩ·□-1.

       

      Abstract: To improve the surface quality of Ni-P coatings,a new technology of electroless Ni-P plating on ABS plastic substrate with sodium hypophosphite as reductant at room temperature has been developed.And properties of the Ni-P coatings were characterized.The results show that the optimized composition of the bath is 28 g·L-1 nickel sulfate,27 g·L-1 sodium hypophosphite,50 g·L-1 sodium citrate,50 g·L-1 ammonium chloride,0.002 5 g·L-1 sodium dodecylbenzene sulfonate,and the process parameters are pH 8.5-9,temperature 25-30 ℃.With 10 μm thickness,Ni-P coatings has excellent adhesion and smoothness,first grade visual brightness,low hardness and 10 μΩ·□-1 surface electricity resistance.

       

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