Erosive Wear Resistance of Siliconizing Layer Prepared on Industrial Pure Copper Surface Using Gangue as Siliconizing Medium
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摘要: 以煤矸石为渗硅剂、铝粉为还原剂, 采用固体粉末包埋法在850 ℃下保温12 h对工业纯铜进行渗硅处理, 获得了600 μm厚的渗硅层; 利用X射线衍射仪、扫描电镜等分析了渗硅层的物相组成和截面形貌, 并测试了渗硅层的显微硬度和冲蚀磨损性能。结果表明: 渗硅层内新生成了Cu0.83Si0.17、Cu4Si、Cu3Al和Cu9Si相, 横截面组织由扩散层的亚共析体α+(α+γ)相、过渡层的α相和纯铜基体呈梯度组成; 渗硅层的最高显微硬度相对纯铜基体提高了3.74倍; 当冲蚀介质的水砂比为50∶16~50∶40时, 渗硅层的冲蚀磨损性能较工业纯铜的提高了1.65~2.40倍; 当转速为200~400 r·min-1时, 渗硅层的冲蚀磨损性能较工业纯铜的提高了1.78~2.25倍; 当冲蚀角为30°~90°时, 渗硅层的冲蚀磨损性能较工业纯铜的提高了1.22~2.62倍。Abstract: Using gangue as siliconing medium and Al powders as reducing agent, the siliconizing layer with thickness of 600 μm was prepared on industrial pure copper surface at 850 ℃ for 12 h by the method of solid powders pack comentation. The phase composition and cross sectional morphology of the siliconizing layer were analyzed by X-ray diffractometer and scanning electron microscopy, and the microhardness and erosive wear resistance of the siliconizing layer were tested as well. The results show that the new phases including Cu0.83Si0.17,Cu4Si,Cu3Al and Cu9Si were existed in the siliconizing layer which were made up of α+(α+γ) phases in diffusion layer, α phase in transition layer and pure copper. The maximum microhardness of the siliconizing layer increased by 3.74 times compared with the pure copper and when the ratios of water to sand in erosive medium ranged from 50∶16 to 50∶40, the erosive wear resistance of the siliconizing layer increased by 1.65-2.40 times, when the rotation rates ranged from 200 r·min-1 to 400 r·min-1, the erosive wear resistance of the siliconizing layer increased by 1.78-2.25 times, when the erosive angles ranged from 30° to 90°, the erosive wear resistance of the siliconizing layer increased by 1.22-2.62 times.
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Keywords:
- gangue /
- siliconizing /
- industrial pure copper /
- erosive wear resistance
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