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    李仕明, 余春, 陆皓. 锗元素对Sn-3.5Ag合金/铜界面反应的影响[J]. 机械工程材料, 2009, 33(9): 21-24.
    引用本文: 李仕明, 余春, 陆皓. 锗元素对Sn-3.5Ag合金/铜界面反应的影响[J]. 机械工程材料, 2009, 33(9): 21-24.
    shu
    LI Shi-ming, YU Chun, LU Hao. Effect of Ge on Interfacial Reaction Sn-3.5Ag Alloy/Cu Interface[J]. Materials and Mechanical Engineering, 2009, 33(9): 21-24.
    Citation: LI Shi-ming, YU Chun, LU Hao. Effect of Ge on Interfacial Reaction Sn-3.5Ag Alloy/Cu Interface[J]. Materials and Mechanical Engineering, 2009, 33(9): 21-24.
    shu

    锗元素对Sn-3.5Ag合金/铜界面反应的影响

    Effect of Ge on Interfacial Reaction Sn-3.5Ag Alloy/Cu Interface

      摘要
    • 摘要: 通过向Sn-3.5Ag共晶合金中添加质量分数为0.1%,0.3%的锗元素,研究了锗元素对Sn-3.5Ag合金/铜界面反应的影响.结果表明:对于Sn-3.5Ag合金/铜界面,没加入锗元素时界面反应初生相为扇贝状Cu6Sn5,在热老化过程中此化合物层不断长大,且在Cu6Sn5/铜界面处生成新的Cu3Sn化合物,同时在Cu3Sn/铜界面上出现柯肯达尔空洞;当钎料中添加锗后,界面初生相也为Cu6Sn5化合物,在热老化阶段,Cu6Sn5化合物层厚度增长非常缓慢,且无Cu3Sn化合物生成,整个老化过程中都无柯肯达尔空洞出现.

       

      Abstract: Effect of Ge on the interfacial reaction of Sn-3.5Ag alloy (SA)/Cu interface was investigated through adding a small amount of Ge (0.1wt%,0.3wt%) into Sn-3.5 Ag emtectic alloy.The results show that the initial phase at the SA/Cu interface without Ge addition was scallop like Cu6Sn5.A new layer,which was determined as Cu3Sn,was formed at Cu6Sn5/Cu interface and grew continously after isothermal aging,and Kirkendall voids were found at Cu3Sn/Cu interface.For SA-xGe/Cu interface,the initial phase was still Cu6Sn5.The growth rate of Cu6Sn5 was decelerated.The Cu3Sn did not form.During aging,no Kirkendall voids were found.

       

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