Microstructure and Properties of MgO/Cu Composite Internal Oxidation Layer Prepared on Cu-Mg Alloy Surface
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摘要: 采用内氧化法在铜镁合金表面制备了MgO/Cu复合材料内氧化层,研究了内氧化时间对内氧化层厚度、硬度、导电率的影响以及内氧化层的组织,并分析了铜镁合金的内氧化热力学。结果表明:随着内氧化时间延长,内氧化层的厚度和导电率均逐渐增加,硬度则先升后降;当内氧化时间为10 h时,内氧化层的性能最佳,导电率为75.9 %IACS,硬度为123.3 HV;铜镁合金经内氧化后,固溶在铜基体内的镁以MgO的形式析出形成内氧化层,MgO颗粒弥散分布是内氧化层综合性能大幅提高的根本原因;铜镁合金内氧化热力学的临界氧分压,介于10-31 419/T+5.66和10-17 611/T + 12.91之间。
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关键词:
- MgO/Cu复合材料 /
- 内氧化法 /
- 导电率 /
- 硬度
Abstract: MgO/Cu composite internal oxidation layer on Cu-Mg alloy surface was prepared by internal oxidation. The effects of internal oxidation time on the thickness,hardness and electric conductivity of internal oxidation layer as well as the microstructure were studied,and the internal oxidation thermodynamics of Cu-Mg alloy was analyzed,too. The results show that the thickness and electric conductivity of the internal oxide layer increased,the hardness was increased and then decreased with the increase of internal oxidation time. When the internal oxidation time was 10 h,the internal oxidation layer had the best comprehensive properties,the hardness was 123.3 HV and electric conductivity was 75.9 %IACS. After internal oxidation,the Mg element dissolved in Cu substrate precipitated in the shape of MgO to form internal oxidation layer,and the dispersive distribution of MgO particles was the primary reason of increasing comprehensive properties of internal oxidation layer a lot. The critical oxygen partial pressure of internal oxidation thermodynamics of Cu-Mg alloy 10-31 419/T+5.66-10-17 611/T+12.91.-
Keywords:
- MgO/Cu composite /
- internal oxidizing /
- electric conductivity /
- hardness
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