Abstract: Eutectic 80Au-20Sn solder alloy is particularly attractive for high-power electronics and optoelectronics packaging as the hermetic sealing and die attachment material.The reliability of solder joint is essential to meet the global demand for long operating lifetime in their applications.The research background of 80Au-20Sn solder joint is briefly reviewed first,and then the reliability assesment methods and the effects of different crafts are introduced.It is pointed that the focus of the study would be the process optimization,the reliability testing methods,the life prediction model and the constitutive model under complex service conditions.