Abstract: The effect of low stable magnetic field (0.1 T) on the growth behaviors of intermetallic compound (IMC) layers,crystallographic orientation and morphology of IMC grains in interfacial reactions of Sn-Zn substrate alloy liquid/Cu plate and Sn-Zn-Cu substrate alloy liquid/Cu plate was studied using SEM and XRD.The results indicate that the IMC layer grew thicker with reaction time prolonged,and the growth of IMC layers of Sn-Zn/Cu and Sn-Zn-Cu/Cu was inhibited in 0.1 T magnetic field.The IMC grains were refined and dense IMC grains.0.1T magnetic field suppressed orientation degree with (330) of Cu5Zn8 in the interface of Sn-Zn/Cu,but the effect of stable magnetic field on the Cu5Zn8 crystal alignment was unobvious.