Process Optimization for Continuous Copper Electroplating on Long Carbon Fiber Surface

TAO Da-wei; DAI Meng-jia; CAO Yu-jie; WANG Wen-fang; LIU Jia-qin

doi:10.11973/jxgccl201703007

Materials and Mechanical Engineering > 2017 > 41(3): 33-38. > DOI: 10.11973/jxgccl201703007

TAO Da-wei, DAI Meng-jia, CAO Yu-jie, WANG Wen-fang, LIU Jia-qin. Process Optimization for Continuous Copper Electroplating on Long Carbon Fiber Surface[J]. Materials and Mechanical Engineering, 2017, 41(3): 33-38. DOI: 10.11973/jxgccl201703007

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Process Optimization for Continuous Copper Electroplating on Long Carbon Fiber Surface

1. Institute of Industry & Equipment Technology, Hefei University of Technology, Hefei 230009, China;
2. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China

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Received Date: December 21, 2015
Revised Date: January 15, 2017

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Abstract

Long PAN-based carbon fiber was surface-modified by pyrophosphate copper plating with self-made equipment. The influences of bath composition, current density, plating temperature and pH value of bath on quality of coating were systematically analyzed to optimize the continuous copper electroplating process parameters, and C/Cu composite fiber with better properties was prepared. The results indicate that the problem of black core and agglomeration were well solved by electroplating in a bath with content (mole fraction) ratio 7.0 of P₂O₇^4- to Cu²⁺ and 25 g·L^-1 ammonium citrate as the additive under the conditions of current density of 2.0-2.5 A·dm^-2, bath temperature of 40℃, and bath's pH of 8.2-8.8. The obtained coating is complete, uniform and compact, it also owns high bonding strength, and the C/Cu composite fiber obtains significantly enhanced conductivity.
- longcarbon fiber,
- continuous plating copper,
- process optimization

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