Microstructure and Properties of Sn-Zn-In-Bi-Al Solder Alloy for Sputtering Target Bonding

YAN Huijiang; ZHANG Jianxin; BU Lijing; ZHU Chaogang; YANG Yong; CHU Zhenhua; DONG Yanchun; HE Jining; LIU Na

doi:10.11973/jxgccl201801013

Materials and Mechanical Engineering > 2018 > 42(1): 64-67,71. > DOI: 10.11973/jxgccl201801013

YAN Huijiang, ZHANG Jianxin, BU Lijing, ZHU Chaogang, YANG Yong, CHU Zhenhua, DONG Yanchun, HE Jining, LIU Na. Microstructure and Properties of Sn-Zn-In-Bi-Al Solder Alloy for Sputtering Target Bonding[J]. Materials and Mechanical Engineering, 2018, 42(1): 64-67,71. DOI: 10.11973/jxgccl201801013

Citation:

PDF (3940 KB)

Microstructure and Properties of Sn-Zn-In-Bi-Al Solder Alloy for Sputtering Target Bonding

1. School of Materials Science and Engineering, Hebei University of Technology, Tianjin 300132, China;
2. Fengfan Co., Ltd., Baoding 071051, China

More Information

Received Date: October 27, 2016
Revised Date: October 10, 2017

Graphical Abstract

Abstract

Abstract

Four solder alloys of Sn-7.0Zn-xIn-3.8Bi-0.2Al (x=0, 4.5, 5.0, 5.5) were prepared by microalloying method. The influence of the In content on the microstructure, melting point, wettability, electrical conductivity, thermal conductivity of the solder alloys were studied, and compared with the performance of traditional pure In and Sn solders. The results show that the solder alloys consisted essentially of β-Sn and Zn-rich phases. The melting point of the solder alloys gradually decreased and the wettability, electrical conductivity, thermal conductivity increased with the increase of In content.The melting point and wettability of Sn-7.0Zn-5.0In-3.8Bi-0.2Al solder alloy were better than those of pure Sn solder and close to those of of pure In solder. The resistivity and thermal conductivity of the solder alloy were close to those of of pure Sn solder.It was confirmed that Sn-7.0Zn-5.0In-3.8Bi-0.2Al solder alloy was suitable for sputtering target bonding.
- Sn-Zn-In-Bi-Al solder alloy,
- target bonding,
- microstructure,
- wettability,
- melting point

FullText(HTML)

References (13)

References

[1]	梁静,林小辉. 等离子喷涂技术在溅射靶材制备中的应用[J]. 中国钼业,2014,38(2):43-46.
[2]	段国晨,齐暑华,吴新明.微电子封装用导电胶的研究进展[J].中国胶粘剂,2010,19(2):54-60.
[3]	薛伟峰,刘炳龙.微波芯片元件的导电胶粘接工艺与应用[J].电子工艺技术,2012,33(3):156-159.
[4]	LIN C M. Influence of thermal storage on microstructure and properties of Sn-9Zn-xIn alloys[J]. Canadian Metallurgical Quarterly, 2013, 52(1):98-105.
[5]	SUN L, ZHANG L. The wettability and oxidation resistance of Sn-Zn-X lead-free solder joints[J]. Aer-Advances In Engineering Research, 2015, 20:188-190.
[6]	吴晓婧,薛烽,周健,等. Cu, Ni对Sn-Zn-Al无铅焊料组织和性能的影响[J]. 东南大学学报:自然科学版,2009,39(3):623-628.
[7]	SPINELLI J E, SILVA B L, GARCIA A. Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications[J]. Materials & Design, 2014, 58:482-490.
[8]	HUANG M L, HOU X L, KANG N, et al. Microstructure and interfacial reaction of Sn-Zn-x(Al, Ag) near-eutectic solders on Al and Cu substrates[J].Journal of Materials Science-materials in Electronics, 2014, 25(5):2311-2319.
[9]	吕娟,赵麦群,王秀春,等.微量Re和Al对Sn-9Zn焊料组织与性能的影响[J].电子元件与材料, 2009, 28(8):39-42.
[10]	董明杰. Sn-Bi-In-Zn-Ag系合金组织及连接界面[D].天津:天津大学,2011.
[11]	周健,孙扬善,薛烽.电子产品用无铅焊料的研究现状和趋势[J].机械工程材料,2005, 29(3):11-14.
[12]	袁宜耀, 孙勇, 吴敏. 无铅Sn-Ag-Sb与Sn-Zn-In润湿性研究[J]. 电子工艺技术,2006,28(3):135-138.
[13]	曾令可,漆小玲,王慧,等.氧化物热电材料热导率的研究[J].硅酸盐通报,2009,28(3):525-530.

Cited By

Get Citation

PDF

XML

Article views (15) PDF downloads (6)

Turn off MathJax

Article Contents

Abstract

References

Microstructure and Properties of Sn-Zn-In-Bi-Al Solder Alloy for Sputtering Target Bonding

Abstract

References

Catalog

Export File

Citation

Format

Content