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    XU Kaikai, ZHANG Liang, SUN Lei, XIONG Mingyue, ZHAO Meng, JIANG Nan. Research Progress on Sn-Zn Solder[J]. Materials and Mechanical Engineering, 2020, 44(6): 1-5,32. DOI: 10.11973/jxgccl202006001
    Citation: XU Kaikai, ZHANG Liang, SUN Lei, XIONG Mingyue, ZHAO Meng, JIANG Nan. Research Progress on Sn-Zn Solder[J]. Materials and Mechanical Engineering, 2020, 44(6): 1-5,32. DOI: 10.11973/jxgccl202006001

    Research Progress on Sn-Zn Solder

    • A new Sn-Zn lead-free solder is non-toxic, inexpensive, and has a similar melting point to Sn-Pb solder, which makes it one of the most likely material to replace traditional Sn-Pb solder. On the basis of research results of Sn-Zn system lead-free solder at home and abroad, the effects of the addition of alloying elements on the wettability, oxidation resistance, mechanical properties, microstructure and interface structure of the solder are summarized, and future research direction is put forward.
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