Study of Thermal-Mechanical Coupling Characteristics of Epoxy Resin Potting Structure

Mechanical and physical parameters and curing residual strain of epoxy resin potting material with curing temperature of 60℃ were tested at environmental temperatures of -30-60℃. Taking it as an input condition, the thermal strain of the epoxy resin potting structure was simulated by the finite element simulation, and the results were compared with the test results, and the thermal coupling characteristics of the epoxy resin potting structures were studied. The results show that the relative errors of the simulated thermal strain and the experimental thermal strain of the epoxy resin potting structure were both within the allowable range of the project, the finite element simulation results was accurate. The thermal stress in the range of -30-60℃ was far less than its fracture strength, and it would not crack due to thermal stress in the range of temperature.