Effect of Pulse Current on High Temperature Compression Deformation and Dynamic Recrystallization Behavior of GH4169 Alloy

The processing of GH4169 alloy forgings was simulated by 950℃ high temperature compression test. The high temperature compression deformation and dynamic recrystallization behavior of the alloy under the conditions of pulse current with different densities (0-4.5 kA·mm^-2), and the influence mechanism of pulse current was discussed. The results show that the alloy was more prone to yield during compression under the action of pulse current, and the compressive deformation resistance decreased; the decrease degree of compressive deformation resistance become more obvious with increasing pulse current density, which was directly related to the fact that the electronic wind force generated by pulse current promoted the dislocation motion. With increasing pulse current density, secondary recrystallization occurred after primary recrystallization, this was because that the pulse current could promote atom diffusion, reduce the difficulty of grain boundary migration and promote dynamic recrystallization.