• 中文核心期刊
  • CSCD中国科学引文数据库来源期刊
  • 中国科技核心期刊
  • 中国机械工程学会材料分会会刊
Advanced Search
SHANGGUAN Fujun, SHANG Hailong, MA Bingyang, LI Wenge, ZHAO Yuantao, LIU Fukang, YU Dayi. Nanoindentation Mechanical Properties and Strengthening Mechanism of Magnetron Sputtered Al-Cu Alloy Films[J]. Materials and Mechanical Engineering, 2022, 46(7): 1-5,10. DOI: 10.11973/jxgccl202207001
Citation: SHANGGUAN Fujun, SHANG Hailong, MA Bingyang, LI Wenge, ZHAO Yuantao, LIU Fukang, YU Dayi. Nanoindentation Mechanical Properties and Strengthening Mechanism of Magnetron Sputtered Al-Cu Alloy Films[J]. Materials and Mechanical Engineering, 2022, 46(7): 1-5,10. DOI: 10.11973/jxgccl202207001

Nanoindentation Mechanical Properties and Strengthening Mechanism of Magnetron Sputtered Al-Cu Alloy Films

More Information
  • Received Date: April 06, 2021
  • Revised Date: May 06, 2022
  • Al-Cu alloy films with copper atomic fractions of 0-11.8% were prepared on stainless steel by magnetron sputtering method. The effects of copper content on the microstructure, nanoindentation mechanical properties and strengthening mechanism of the films were investigated. The results show that the pure aluminum film had a face-centered cubic structure. When the copper atomic fraction was between 2.2% and 6.5%, supersaturated solid solution phases were formed in Al-Cu alloy films. When the copper atomic fraction exceeded 6.5%, AlCu compounds were formed in films. With the increase of copper content, the grain size of the film decreased, and the hardness and elastic modulus increased. When the copper atomic fraction increased to 11.8%, the grain size was 34.7 nm, and the hardness and elastic modulus increased by 212.5% and 2.2% those of the pure aluminum film, respectively. When the copper atomic fraction was between 0 and 6.5%, the strengthening of films mainly depended on grain refinement strengthening and solid solution strengthening. When the copper atomic fraction exceeded 6.5%, the strengthening of films was determined by the combination of grain refinement strengthening, solid solution strengthening and second phase strengthening.
  • [1]
    BEDBOUDI H,BOURBIA A,DRAISSIA M,et al.X-ray diffraction studies of nanostructured metallic alloys[J].Journal of Nano Research,2008,3:45-58.
    [2]
    ZAIZEN T, OTOGURO Y, YAMANAKA M, et al. High Al heat-resistant alloy steels having Al coating thereon:US4535034[P]. 1985-08-13.
    [3]
    LEE Z,OPHUS C,FISCHER L M,et al.Metallic NEMS components fabricated from nanocomposite Al-Mo films[J].Nanotechnology,2006,17(12):3063-3070.
    [4]
    SANCHETTE F,LOI T H,BILLARD A,et al.Structure-properties relationship of metastable Al-Cr and Al-Ti alloys deposited by r.f.magnetron sputtering:Role of nitrogen[J].Surface and Coatings Technology,1995,74/75:903-909.
    [5]
    ARNELL R,BATES R.The deposition of highly supersaturated metastable aluminium-magnesium alloys by unbalanced magnetron sputtering from composite targets[J].Vacuum,1992,43(1/2):105-109.
    [6]
    STUBI AČG AR M,TONEJC A,RADI AĆG N.Microhardness characterization of Al-W thin films[J].Vacuum,2001,61(2/3/4):309-316.
    [7]
    RUAN S Y,SCHUH C A.Electrodeposited Al-Mn alloys with microcrystalline,nanocrystalline,amorphous and nano-quasicrystalline structures[J].Acta Materialia,2009,57(13):3810-3822.
    [8]
    BOUKHRIS N,LALLOUCHE S,DEBILI M Y,et al.Microhardness variation and related microstructure in Al-Cu alloys prepared by HF induction melting and RF sputtering[J].The European Physical Journal Applied Physics,2009,45(3):30501.
    [9]
    KUMAR A,JAYAGANTHAN R,CHANDRA R,et al.Nanoindentation study of sputtered Al-Cu thin films for interconnect applications[C]//20068th Electronics Packaging Technology Conference.Singapore:IEEE,2006:560-564.
    [10]
    DRAISSIA M,DEBILI M Y.Study of solid-solution hardening in binary aluminium-based alloys[J].Open Physics,2005,3(3):395-408.
    [11]
    DRAISSIA M,DEBILI M Y.Observation of phase separation in magnetron sputter-deposited Al-Cu thin films[J].Philosophical Magazine Letters,2005,85(8):439-444.
    [12]
    DRAISSIA M,BOUDEMAGH H,DEBLI M Y.Structure and hardness of the sputtered Al-Cu thin films system[J].Physica Scripta,2004,69(4):348-350.
    [13]
    余瑞璜.固体与分子经验电子理论[J].科学通报,1978,23(4):217-224.

    YU R H.Empirical electron theory of solids and molecules[J].Chinese Science Bulletin,1978,23(4):217-224.
    [14]
    贾淑果,刘平,郑茂盛,等.铜合金固溶强化的电子理论解释[J].中国有色金属学报,2008,18(8):1522-1526.

    JIA S G,LIU P,ZHENG M S,et al.Explanation based on electron theory for solid solution strengthening in copper alloy[J].The Chinese Journal of Nonferrous Metals,2008,18(8):1522-1526.
    [15]
    MA K K,WEN H M,HU T,et al.Mechanical behavior and strengthening mechanisms in ultrafine grain precipitation-strengthened aluminum alloy[J].Acta Materialia,2014,62:141-155.
    [16]
    FLEISCHER R L.Substitutional solution hardening[J].Acta Metallurgica,1963,11(3):203-209.

Catalog

    Article views (9) PDF downloads (2) Cited by()

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return