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    BAI Shaoyun, LÜ Yanming, ZHAO Peng, PAN Yu, LIU Haocheng, HUANG Qiang. Numerical Simulation of Thermodynamic Field of GH4169 Nickel-Based Superalloy Arc Additive Manufacturing under Different Processes[J]. Materials and Mechanical Engineering, 2022, 46(9): 89-95. DOI: 10.11973/jxgccl202209015
    Citation: BAI Shaoyun, LÜ Yanming, ZHAO Peng, PAN Yu, LIU Haocheng, HUANG Qiang. Numerical Simulation of Thermodynamic Field of GH4169 Nickel-Based Superalloy Arc Additive Manufacturing under Different Processes[J]. Materials and Mechanical Engineering, 2022, 46(9): 89-95. DOI: 10.11973/jxgccl202209015

    Numerical Simulation of Thermodynamic Field of GH4169 Nickel-Based Superalloy Arc Additive Manufacturing under Different Processes

    • The finite element model of arc additive manufactured GH4169 nickel-based superalloy was established by Simufact Welding software, and the model was verified by tests. The thermodynamic field and deformation during multilayer single-pass forming under different deposition paths (unidirectional deposition, reciprocating deposition) and different interlayer cooling times (0, 60, 120 s) were analyzed. The results show that the simulated thermal cycle curve and residual stress during arc additive manufacturing agreed with the test results, and the relative errors were less than 9% and 3%, respectively, verifying the accuracy of the model. Compared with unidirectional deposition path, the reciprocating deposition path could improve the homogeneity of heat distribution and stress field distribution of the formed parts; the influence area of stress field and heat accumulation was relatively small, the temperature and residual stress were relatively low, and the deformation symmetry was relatively good. With increasing interlayer cooling time, the heat accumulation, residual stress and deformation decreased, but the decrease amplitude was reduced gradually. The forming quality of arc additive manufactured GH4169 nickel-base superalloy was good by applying the reciprocating deposition path and interlayer cooling for 60 s.
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