Research Progress on Epoxy Resin Matrix Composites for Electronic Packaging

CHEN Xiaowen; JIANG Tao; LI Wenge

doi:10.11973/jxgccl230594

Materials and Mechanical Engineering > 2024 > 48(12): 1-8. > DOI: 10.11973/jxgccl230594

CHEN Xiaowen, JIANG Tao, LI Wenge. Research Progress on Epoxy Resin Matrix Composites for Electronic Packaging[J]. Materials and Mechanical Engineering, 2024, 48(12): 1-8. DOI: 10.11973/jxgccl230594

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Research Progress on Epoxy Resin Matrix Composites for Electronic Packaging

1.
School of Materials and Environmental Engineering, Shenzhen Polytechnic University, Shenzhen 518055, China
2.
College of Merchant Marine, Shanghai Maritime University, Shanghai 201306, China

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Received Date: December 17, 2023
Revised Date: October 27, 2024

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Abstract

Abstract

Epoxy resin is the most widely used plastic-based electronic packaging material, but its low thermal conductivity limits its application in the field of electronic packaging. Through the modification of resin and the addition of high thermal conductivity filler can effectively improve the thermal conductivity of epoxy resin. The types and research progress of epoxy resin matrix composites are summarized. The various performance requirements of electronic packaging on epoxy resin matrix composites are introduced, including high thermal conductivity, insulation, low dielectric properties and flame retardancy. The modification methods of epoxy resin matrix composites with different properties are reviewed. Finally, it outlines future directions for epoxy resin matrix composites for electronic packaging.
- electronic packaging,
- epoxy resin matrix composite,
- thermal conductivity,
- dielectric property,
- insulation performance

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References (52)

References

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