Interfacial Microstructure and Properties of ZCuSn10P1 Copper Alloy Surfacing SnSb9Cu7 Babbitt Alloy

The SnSb9Cu7 Babbitt alloy as surfacing on the ZCuSn10P1 copper alloy by cold metal transition molten tungsten argon arc welding. The microstructure and micro-composition at the interface were studied, and the bonding strength and micro-nano mechanical properties were tested. The results show that an interfacial layer of about 140 μm thickness was formed between copper alloy and Babbitt alloy cladding layer, indicating that metallurgical bonding. The interface was smooth, and the interfacial layer had no micro-cracks, pores and other defects, and was composed of α+δ phase. The Babbitt alloy cladding layer was composed of SnSb phase, Cu₆Sn₅ phase and α-Sn matrix. The microstructure of the cladding layer was uniform and fine, no obvious segregation was found, and the hard phase particle size was about 35 μm. The bonding strength of the interface was about 101 MPa, and the fracture mainly occured in hard phases of Babbitt alloy cladding layer. The microhardness of Babbitt alloy cladding layer, copper alloy and the interfacial layer was 6.199, 7.401 and 8.205 GPa, respectively