Effect of Ultrasonic-Pulse Electroforming Process Parameters on Grain Size of Nickel Electroforming Layer

The nickel electroforming layer was prepared by ultrasonic-pulse electroforming process in the micro-region on employed copper clad laminate (CCL) surface. The surface morphology of nickel electroforming layer was observed by scanning electron microscopy and the average grain size was measured by Image Tool software, and the effects of ultrasonic power and direction, pulse average current density and pulse duty ratio on the grains size of nickel electroforming layer were studied. The results show that when other conditions were remained unchanged, the grain size of nickel electroforming layer prepared under double-direction ultrasonic (y direction and z direction) was less than that under single-direction ultrasonic(y direction or z direction). And the grain size of nickel eletroforming layer decreased first and then increased with the increase of ultrasonic power and the pulse average current density. The grain size of nickel electroforming layer increased from 0.97 μm to 3.32 μm when the pulse duty ratio increased from 10% to 30%.