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    YUAN Xun-feng, DING Yu-tian, HU Yong. Phase-Field Simulation of Al-Cu Binary Alloy during Directional Solidification[J]. Materials and Mechanical Engineering, 2010, 34(1): 96-100.
    Citation: YUAN Xun-feng, DING Yu-tian, HU Yong. Phase-Field Simulation of Al-Cu Binary Alloy during Directional Solidification[J]. Materials and Mechanical Engineering, 2010, 34(1): 96-100.

    Phase-Field Simulation of Al-Cu Binary Alloy during Directional Solidification

    • The phase-field model based on KKS model which couples the solute field was used to simulate the process during directional solidification for Al-Cu binary alloy.Frozen temperature approximation was adopted to simplify the modeling.The effects of the parameters such as an isotropy coefficient,interface energy and interface thickness on interface morphology and micro-segregation were formulated.The results show that shallow cellular dendrite growth was the major growth pattern in isotropic circumstances.After introduction of the anisotropy,with the increase of the anisotropy coefficient the crystal growth transformed to deep cell from shallow cell.With the increase of interface energy and interface thickness,the crystal growth transformed to shallow cell from deep cell.
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