Analysis of Residual Stress in Coarse-Grained Fe-Si Alloy by X-Ray Diffraction

Residual stress in coarse-grained Fe-Si alloy with different tensile deformations were analyzed by a method proposed by Imura for measuring residual stress in single crystal material. Firstly, the diffraction peak positions were found using the diffract-meter, and then the residual stress was calculated according to the plane index and the method of Imura. The results show that the method could be used for the determination of residual stress in this material. With the increase of deformation degree, the full width at half maximum (FWHM) of each diffracted plane increased. When the accuracy of position parameters was 0.25° and the accuracy of diffraction angle was 0.01°, the calculated results were in line with the theoretical value of the tensile stress state.