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JIANG Xiao, HE Zhu, GAO Biao, CAI Hui, LIU Chun-huan, XU Zhi-an, ZHU Xin-yang. Modeling of Thermal Conductivity of Hollow-Glass-Bead/Epoxy Resin Composite by Finite Element Method[J]. Materials and Mechanical Engineering, 2015, 39(5): 93-96.
Citation: JIANG Xiao, HE Zhu, GAO Biao, CAI Hui, LIU Chun-huan, XU Zhi-an, ZHU Xin-yang. Modeling of Thermal Conductivity of Hollow-Glass-Bead/Epoxy Resin Composite by Finite Element Method[J]. Materials and Mechanical Engineering, 2015, 39(5): 93-96.
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Modeling of Thermal Conductivity of Hollow-Glass-Bead/Epoxy Resin Composite by Finite Element Method

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  • Received Date: November 04, 2014
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    • Abstract
  • A mathematic model for four hollow-glass-bead(HGB)/epoxy resin composites with HGB random distribution was set up by finite element method using ANSYS software.The thermal conductivities of the composites at room temperature were calculated, and the predicted results were compared with the test results in some reference.The results show that the thermal insulation effect of HGB was remarkable.With the increase in volume fraction of HGBs,the thermal conductivity of HGB/epoxy resin composites linearly decreased.The predicted results in accordance with the experimental results in the reference were proved to be accurate.
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    • References (17)
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