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    LI Rong, LIU Xiang-xuan, WANG Xuan-jun. Electroless Ni-P Plating on ABS Plastic Substrate with Sodium Hypophosphite as Reductant at Room Temperature[J]. Materials and Mechanical Engineering, 2008, 32(7): 46-48.
    Citation: LI Rong, LIU Xiang-xuan, WANG Xuan-jun. Electroless Ni-P Plating on ABS Plastic Substrate with Sodium Hypophosphite as Reductant at Room Temperature[J]. Materials and Mechanical Engineering, 2008, 32(7): 46-48.

    Electroless Ni-P Plating on ABS Plastic Substrate with Sodium Hypophosphite as Reductant at Room Temperature

    • To improve the surface quality of Ni-P coatings,a new technology of electroless Ni-P plating on ABS plastic substrate with sodium hypophosphite as reductant at room temperature has been developed.And properties of the Ni-P coatings were characterized.The results show that the optimized composition of the bath is 28 g·L-1 nickel sulfate,27 g·L-1 sodium hypophosphite,50 g·L-1 sodium citrate,50 g·L-1 ammonium chloride,0.002 5 g·L-1 sodium dodecylbenzene sulfonate,and the process parameters are pH 8.5-9,temperature 25-30 ℃.With 10 μm thickness,Ni-P coatings has excellent adhesion and smoothness,first grade visual brightness,low hardness and 10 μΩ·□-1 surface electricity resistance.
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