Erosive Wear Resistance of Siliconizing Layer Prepared on Industrial Pure Copper Surface Using Gangue as Siliconizing Medium

Using gangue as siliconing medium and Al powders as reducing agent, the siliconizing layer with thickness of 600 μm was prepared on industrial pure copper surface at 850 ℃ for 12 h by the method of solid powders pack comentation. The phase composition and cross sectional morphology of the siliconizing layer were analyzed by X-ray diffractometer and scanning electron microscopy, and the microhardness and erosive wear resistance of the siliconizing layer were tested as well. The results show that the new phases including Cu0.83Si0.17,Cu4Si,Cu3Al and Cu9Si were existed in the siliconizing layer which were made up of α+(α+γ) phases in diffusion layer, α phase in transition layer and pure copper. The maximum microhardness of the siliconizing layer increased by 3.74 times compared with the pure copper and when the ratios of water to sand in erosive medium ranged from 50∶16 to 50∶40, the erosive wear resistance of the siliconizing layer increased by 1.65-2.40 times, when the rotation rates ranged from 200 r·min-1 to 400 r·min-1, the erosive wear resistance of the siliconizing layer increased by 1.78-2.25 times, when the erosive angles ranged from 30° to 90°, the erosive wear resistance of the siliconizing layer increased by 1.22-2.62 times.